公开(公告)号：US20170221952A1

公开(公告)日：2017-08-03

申请号：US15487473

申请日：2017-04-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Chin Huang ,  Pao-Tung Chen ,  Wei-Chieh Chiang ,  Kazuaki Hashimoto ,  Jen-Cheng Liu

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/1469

Abstract: An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

公开(公告)号：US09634053B2

公开(公告)日：2017-04-25

申请号：US14564231

申请日：2014-12-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Chin Huang ,  Pao-Tung Chen ,  Wei-Chieh Chiang ,  Kazuaki Hashimoto ,  Jen-Cheng Liu

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/1469

Abstract: An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

公开(公告)号：US10134794B2

公开(公告)日：2018-11-20

申请号：US15487473

申请日：2017-04-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Chin Huang ,  Pao-Tung Chen ,  Wei-Chieh Chiang ,  Kazuaki Hashimoto ,  Jen-Cheng Liu

IPC: H01L27/146

Abstract: An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

公开(公告)号：US20160163755A1

公开(公告)日：2016-06-09

申请号：US14564231

申请日：2014-12-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Chin Huang ,  Pao-Tung Chen ,  Wei-Chieh Chiang ,  Kazuaki Hashimoto ,  Jen-Cheng Liu

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/1469

Abstract: An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.

Abstract translation: 提供了具有将图像传感器芯片接合和/或电耦合到封装基板的侧壁互连结构的图像传感器芯片。 图像传感器芯片包括支撑被配置为感测入射光的集成电路（IC）的基板。 侧壁互连结构沿着衬底的侧壁布置并且与IC电耦合。 还提供了一种用于制造图像传感器芯片的方法和包括图像传感器芯片的图像传感器封装。