公开(公告)号：US20230398659A1

公开(公告)日：2023-12-14

申请号：US17822867

申请日：2022-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Chih Hung Chen ,  Liang-Che Chen ,  Shich-Chang Suen ,  Liang-Guang Chen

IPC: B24D3/00 ,  B24B7/22 ,  H01L21/304

CPC classification number: B24D3/00 ,  H01L21/304 ,  B24B7/228

Abstract: Polishing pads having varying protrusions and methods of forming the same are disclosed. In an embodiment, a polishing pad includes a polishing pad substrate; a first protrusion on the polishing pad substrate, the first protrusion including a central region and a peripheral region surrounding the central region, and a first hardness of the central region being greater than a second hardness of the peripheral region; and a first groove adjacent a first side of the first protrusion.