公开(公告)号：US11804410B2

公开(公告)日：2023-10-31

申请号：US16810607

申请日：2020-03-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-De Ho ,  Han-Wei Wu ,  Pei-Sheng Tang ,  Meng-Jung Lee ,  Hua-Tai Lin ,  Szu-Ping Tung ,  Lan-Hsin Chiang

IPC: H01L21/66 ,  H01L21/67

CPC classification number: H01L22/12 ,  H01L21/67288

Abstract: A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.