公开(公告)号：US09048655B2

公开(公告)日：2015-06-02

申请号：US13675547

申请日：2012-11-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Qingchao Meng ,  Lei Pan ,  Shao-Yu Chou

IPC: H02H9/00 ,  H02H9/04 ,  H01C7/12 ,  H02H1/00 ,  H02H1/04 ,  H02H3/22 ,  H02H9/06

CPC classification number: H02H9/043 ,  H02H9/046

Abstract: Some embodiments relate to an IC that includes an ESD-susceptible circuit. The IC includes a number of IC pads that are electrically coupled to respective nodes on the ESD-susceptible circuit. The IC pads are electrically accessible from external to the IC, and include one or more power supply pads and one or more I/O pads. The IC also includes a number of ESD protection devices coupled to the plurality of IC pads, respectively. A trigger circuit on the IC is configured to detect an ESD event impingent on a power supply pad and, in response to the detection, to trigger concurrent shunting of energy of the ESD event over both an ESD clamp element of an I/O pad and an ESD clamp element of the power supply pad. Other embodiments are also disclosed.

Abstract translation: 一些实施例涉及包括ESD敏感电路的IC。 IC包括多个IC焊盘，其电耦合到ESD敏感电路上的相应节点。 IC焊盘可以从IC的外部电可访问，并且包括一个或多个电源焊盘和一个或多个I / O焊盘。 IC还包括分别耦合到多个IC焊盘的多个ESD保护器件。 IC上的触发电路被配置为检测照射在电源焊盘上的ESD事件，并且响应于该检测，触发I / O焊盘的ESD钳位元件上ESD事件的能量并发分流，以及 电源板的ESD钳位元件。 还公开了其他实施例。

公开(公告)号：US20140118869A1

公开(公告)日：2014-05-01

申请号：US13675547

申请日：2012-11-13

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Qingchao Meng ,  Lei Pan ,  Shao-Yu Chou

IPC: H02H9/04

CPC classification number: H02H9/043 ,  H02H9/046

Abstract: Some embodiments relate to an IC that includes an ESD-susceptible circuit. The IC includes a number of IC pads that are electrically coupled to respective nodes on the ESD-susceptible circuit. The IC pads are electrically accessible from external to the IC, and include one or more power supply pads and one or more I/O pads. The IC also includes a number of ESD protection devices coupled to the plurality of IC pads, respectively. A trigger circuit on the IC is configured to detect an ESD event impingent on a power supply pad and, in response to the detection, to trigger concurrent shunting of energy of the ESD event over both an ESD clamp element of an I/O pad and an ESD clamp element of the power supply pad. Other embodiments are also disclosed.

Abstract translation: 一些实施例涉及包括ESD敏感电路的IC。 IC包括多个IC焊盘，其电耦合到ESD敏感电路上的相应节点。 IC焊盘可以从IC的外部电可访问，并且包括一个或多个电源焊盘和一个或多个I / O焊盘。 IC还包括分别耦合到多个IC焊盘的多个ESD保护器件。 IC上的触发电路被配置为检测照射在电源焊盘上的ESD事件，并且响应于该检测，触发I / O焊盘的ESD钳位元件上ESD事件的能量并发分流，以及 电源板的ESD钳位元件。 还公开了其他实施例。