公开(公告)号：US20200058589A1

公开(公告)日：2020-02-20

申请号：US16422988

申请日：2019-05-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hong-Seng SHUE ,  Sheng-Han TSAI ,  Kuo-Chin CHANG ,  Mirng-Ji LII ,  Kuo-Ching HSU

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/522

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a redistribution layer over the substrate. The chip structure includes a bonding pad over the redistribution layer. The chip structure includes a shielding pad over the redistribution layer and surrounding the bonding pad. The chip structure includes an insulating layer over the redistribution layer and the shielding pad. The chip structure includes a bump over the bonding pad and the insulating layer. A sidewall of the bump is over the shielding pad.