公开(公告)号：US10513006B2

公开(公告)日：2019-12-24

申请号：US13758378

申请日：2013-02-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jiann Lih Wu ,  Jason Shen ,  Soon-Kang Huang ,  James Jeng-Jyi Hwang ,  Chi-Ming Yang

IPC: B24B37/005

Abstract: A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to perform an auxiliary chemical-mechanical polish on the workpiece when the workpiece is positioned on the rework platen. A measurement apparatus measures one or more parameters of the workpiece, and a transport apparatus transports the workpiece between the first polishing apparatus, second polishing apparatus, rework polishing apparatus, and measurement apparatus. A controller determines a selective transport of the workpiece to the rework polishing apparatus by the transport apparatus only when the one or more parameters are unsatisfactory.

公开(公告)号：US20140220863A1

公开(公告)日：2014-08-07

申请号：US13758378

申请日：2013-02-04

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Jiann Lih Wu ,  Jason Shen ,  Soon-Kang Huang ,  James Jeng-Jyi Hwang ,  Chi-Ming Yang

IPC: B24B37/005

CPC classification number: B24B37/005

Abstract: A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to perform an auxiliary chemical-mechanical polish on the workpiece when the workpiece is positioned on the rework platen. A measurement apparatus measures one or more parameters of the workpiece, and a transport apparatus transports the workpiece between the first polishing apparatus, second polishing apparatus, rework polishing apparatus, and measurement apparatus. A controller determines a selective transport of the workpiece to the rework polishing apparatus by the transport apparatus only when the one or more parameters are unsatisfactory.

Abstract translation: 化学机械抛光系统具有被配置为在工件上执行第一化学机械抛光的第一抛光装置和被配置为在工件上执行第二化学机械抛光的第二抛光装置。 包括返工板和返工CMP头的返工抛光装置构造成当工件位于返工台板上时在工件上执行辅助化学 - 机械抛光。 测量装置测量工件的一个或多个参数，并且输送装置在第一抛光装置，第二抛光装置，返工抛光装置和测量装置之间输送工件。 只有当一个或多个参数不令人满意时，控制器确定由输送装置选择性地将工件输送到返工抛光装置。