公开(公告)号：US20210066226A1

公开(公告)日：2021-03-04

申请号：US16866562

申请日：2020-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chiang-Jui Chu ,  Ching-Wen Hsiao ,  Hao-Chun Liu ,  Ming-Da Cheng ,  Young-Hwa Wu ,  Tao-Sheng Chang

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: Electrical devices, semiconductor packages and methods of forming the same are provided. One of the electrical devices includes a substrate, a conductive pad, a conductive pillar and a solder region. The substrate has a surface. The conductive pad is disposed on the surface of the substrate. The conductive pillar is disposed on and electrically connected to the conductive pad, wherein a top surface of the conductive pillar is inclined with respect to the surface of the substrate. The solder region is disposed on the top surface of the conductive pillar.