公开(公告)号：US10609463B2

公开(公告)日：2020-03-31

申请号：US15797813

申请日：2017-10-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Wen Cheng ,  Wen-Cheng Kuo ,  Chia-Hua Chu ,  Chun-Yin Tsai ,  Tzu-Heng Wu

IPC: H04R1/08 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.

公开(公告)号：US11184694B2

公开(公告)日：2021-11-23

申请号：US16813923

申请日：2020-03-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chun-Wen Cheng ,  Chia-Hua Chu ,  Chun-Yin Tsai ,  Tzu-Heng Wu ,  Wen-Cheng Kuo

IPC: H04R1/08 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.