公开(公告)号：US10658263B2

公开(公告)日：2020-05-19

申请号：US15993615

申请日：2018-05-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chi-Yang Yu ,  Chin-Liang Chen ,  Kuan-Lin Ho ,  Yu-Min Liang ,  Wen-Lin Chen

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

公开(公告)号：US11508640B2

公开(公告)日：2022-11-22

申请号：US16874621

申请日：2020-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chi-Yang Yu ,  Chin-Liang Chen ,  Kuan-Lin Ho ,  Yu-Min Liang ,  Wen-Lin Chen

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

公开(公告)号：US20200279790A1

公开(公告)日：2020-09-03

申请号：US16874621

申请日：2020-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chi-Yang Yu ,  Chin-Liang Chen ,  Kuan-Lin Ho ,  Yu-Min Liang ,  Wen-Lin Chen

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.