公开(公告)号：US20230369380A1

公开(公告)日：2023-11-16

申请号：US17740544

申请日：2022-05-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Y.C. Chang ,  Yen-Ting Chiang ,  Shyh-Fann Ting ,  Jen-Cheng Liu

IPC: H01L27/146

CPC classification number: H01L27/14683 ,  H01L27/14643 ,  H01L27/14627 ,  H01L27/14621 ,  H01L27/14636

Abstract: The present disclosure describes an image sensor and a method for forming the image sensor. The image sensor includes an image sensing element disposed on a substrate, an extension pad disposed adjacent to the image sensing element, and a polysilicon pillar disposed on the extension pad. The image sensor further includes an insulating layer disposed over the image sensing element, the extension pad, and the polysilicon pillar.