公开(公告)号：US20250167037A1

公开(公告)日：2025-05-22

申请号：US18512146

申请日：2023-11-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsi Wang ,  Yen-Yu Chen ,  Yi-Hu Lo ,  Pei-Shih Tsai ,  Zong-Kun Lin

IPC: H01L21/687 ,  H01L21/306 ,  H01L21/67

Abstract: A wafer chuck assembly is provided. In one embodiment, the chuck assembly comprises a hub, a plurality of arms mounted to the hub and a plurality of holders. Each arm extends outwardly from the hub, and each arm has a proximal end adjacent the hub and a distal end remote from the hub. Each holder is mounted at the distal end of each respective arm, and each holder has a plurality of support pins configured to support a wafer.