公开(公告)号：US20250167161A1

公开(公告)日：2025-05-22

申请号：US18585854

申请日：2024-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Jin Hu ,  Hua-Wei Tseng ,  Wei-Cheng Wu ,  Yung-Ping Chiang ,  An-Jhih Su ,  Der-Chyang Yeh

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: A package includes a first die over and bonded to a first side of a package component, where a first bond between the first die and the package component includes a dielectric-to-dielectric bond between a first bonding layer of the first die and a second bonding layer on the package component, and second bonds between the first die and the package component include metal-to-metal bonds between first bonding pads of the first die and second bonding pads on the package component, a first portion of a redistribution structure adjacent to the first die and over the second bonding layer, and a second die over and coupled to the first portion of the redistribution structure using first conductive connectors, where the first conductive connectors are electrically connected to first conductive pads in the second bonding layer.