公开(公告)号：US20220384286A1

公开(公告)日：2022-12-01

申请号：US17818437

申请日：2022-08-09

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shin CHI ,  Chien Hao HSU ,  Kuo-Chin CHANG ,  Cheng-Nan LIN ,  Mirng-Ji LII

IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

摘要： A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip over the substrate. The chip package structure includes a first heat conductive layer between the heat-spreading wall structure and the chip. The chip package structure includes a second heat conductive layer over the chip and surrounded by the first heat conductive layer. The chip package structure includes a heat-spreading lid over the substrate and covering the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.