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公开(公告)号：US20220063993A1
公开(公告)日：2022-03-03
申请号：US17524140
申请日：2021-11-11
发明人： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
摘要： A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.
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公开(公告)号：US11772963B2
公开(公告)日：2023-10-03
申请号：US17524140
申请日：2021-11-11
发明人： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
CPC分类号： B81C1/00238 , B81C1/00269 , B81C1/00888 , B81C3/005 , B81C2201/013 , B81C2201/0143 , B81C2201/0146 , B81C2203/035
摘要： A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.
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公开(公告)号：US20230365402A1
公开(公告)日：2023-11-16
申请号：US18354012
申请日：2023-07-18
发明人： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
CPC分类号： B81C1/00238 , B81C1/00269 , B81C1/00888 , B81C3/005 , B81C2201/013 , B81C2201/0143 , B81C2201/0146 , B81C2203/035
摘要： A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.
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