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    Package structure
    1.
    发明授权
    Package structure 有权

    公开(公告)号：US11630271B2

    公开(公告)日：2023-04-18

    申请号：US17873992

    申请日：2022-07-26

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Sung-Hui Huang ,  Jui-Hsieh Lai ,  Shang-Yun Hou

    IPC分类号： G02B6/42 ,  H01L25/16

    摘要： A package structure is provided. The package structure includes a waveguide, a passivation layer, and a reflector. The waveguide is over a substrate. The passivation layer is over the substrate and covers the waveguide. The reflector includes a metal layer and a semiconductor layer on the passivation layer. The metal layer and the first semiconductor layer are in contact with the passivation layer.

    Chip package structure
    2.
    发明授权
    Chip package structure 有权

    公开(公告)号：US10985125B2

    公开(公告)日：2021-04-20

    申请号：US17029537

    申请日：2020-09-23

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Kuan-Yu Huang ,  Sung-Hui Huang ,  Shu-Chia Hsu ,  Leu-Jen Chen ,  Yi-Wei Liu ,  Shang-Yun Hou ,  Jui-Hsieh Lai ,  Tsung-Yu Chen ,  Chien-Yuan Huang ,  Yu-Wei Chen

    IPC分类号： H01L29/40 ,  H01L21/44 ,  H01L23/00 ,  H01L21/56 ,  H01L23/522

    摘要： A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.