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公开(公告)号：US11990488B2
公开(公告)日：2024-05-21
申请号：US17249787
申请日：2021-03-12
发明人： Wei-Lin Chen , Ching-Chung Su , Chun-Hao Chou , Kuo-Cheng Lee
IPC分类号： H01L27/146 , H04N25/77
CPC分类号： H01L27/14621 , H01L27/14609 , H01L27/1463 , H04N25/77 , H01L27/14627
摘要： A grid structure in a pixel array may be at least partially angled or tapered toward a top surface of the grid structure such that the width of the grid structure approaches a near-zero width near the top surface of the grid structure. This permits the spacing between color filter regions in between the grid structure to approach a near-zero spacing near the top surfaces of the color filter regions. The tight spacing of color filter regions provided by the angled or tapered grid structure provides a greater surface area and volume for incident light collection in the color filter regions. Moreover, the width of the grid structure may increase at least partially toward a bottom surface of the grid structure such that the wider dimension of the grid structure near the bottom surface of the grid structure provides optical crosstalk protection for the pixel sensors in the pixel array.
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公开(公告)号：US12113042B2
公开(公告)日：2024-10-08
申请号：US17450104
申请日：2021-10-06
发明人： Chun-Liang Lu , Wei-Lin Chen , Chun-Hao Chou , Kuo-Cheng Lee
IPC分类号： H01L23/00
CPC分类号： H01L24/73 , H01L24/11 , H01L24/17 , H01L2224/11466 , H01L2224/11845 , H01L2224/1703 , H01L2224/73104 , H01L2224/9211
摘要： Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first wafer including a first metal structure within a body of the first wafer. The semiconductor structure also includes a second wafer including a second metal structure within a body of the second wafer, where the first wafer is coupled to the second wafer at an interface. The semiconductor structure further includes a metal bonding structure coupled to the first metal structure and the second metal structure and extending through the interface.
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