公开(公告)号：US11786947B2

公开(公告)日：2023-10-17

申请号：US17874405

申请日：2022-07-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Eason Chen ,  Yi-Fam Shiu ,  Sung-Chun Yang ,  Hsu-Shui Liu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： B08B9/20 ,  B08B9/28 ,  F26B3/30 ,  F26B21/00 ,  H01L21/677

CPC分类号： B08B9/205 ,  B08B9/28 ,  F26B3/30 ,  F26B21/004 ,  H01L21/6773

摘要： A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

公开(公告)号：US20210370363A1

公开(公告)日：2021-12-02

申请号：US16887409

申请日：2020-05-29

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Eason Chen ,  Yi-Fam Shiu ,  Sung-Chun Yang ,  Hsu-Shui Liu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： B08B9/20 ,  H01L21/677 ,  B08B9/28 ,  F26B3/30 ,  F26B21/00

摘要： A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

公开(公告)号：US12119251B2

公开(公告)日：2024-10-15

申请号：US17647367

申请日：2022-01-07

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Yu-Chen Chen ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： H01L21/677 ,  B23Q15/00 ,  B23Q16/00 ,  G05D5/04 ,  H01L23/04

CPC分类号： H01L21/6773 ,  B23Q15/00 ,  B23Q16/00 ,  G05D5/04 ,  H01L21/67736 ,  H01L21/67778 ,  H01L23/04

摘要： A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

公开(公告)号：US11813649B2

公开(公告)日：2023-11-14

申请号：US16887409

申请日：2020-05-29

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Eason Chen ,  Yi-Fam Shiu ,  Sung-Chun Yang ,  Hsu-Shui Liu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： B08B9/20 ,  B08B9/28 ,  F26B3/30 ,  F26B21/00 ,  H01L21/677

CPC分类号： B08B9/205 ,  B08B9/28 ,  F26B3/30 ,  F26B21/004 ,  H01L21/6773

摘要： A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

公开(公告)号：US20220362819A1

公开(公告)日：2022-11-17

申请号：US17874405

申请日：2022-07-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Eason Chen ,  Yi-Fam Shiu ,  Sung-Chun Yang ,  Hsu-Shui Liu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： B08B9/20 ,  B08B9/28 ,  F26B3/30 ,  F26B21/00 ,  H01L21/677

摘要： A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

公开(公告)号：US11923225B2

公开(公告)日：2024-03-05

申请号：US17402718

申请日：2021-08-16

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Yi-Fam Shiu ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67393 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67781

摘要： A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.

公开(公告)号：US11915957B2

公开(公告)日：2024-02-27

申请号：US17647367

申请日：2022-01-07

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Yu-Chen Chen ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： H01L21/677 ,  H01L23/04 ,  G05D5/04 ,  B23Q15/00 ,  B23Q16/00

CPC分类号： H01L21/6773 ,  B23Q15/00 ,  B23Q16/00 ,  G05D5/04 ,  H01L21/67736 ,  H01L21/67778 ,  H01L23/04

摘要： A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

公开(公告)号：US11222802B1

公开(公告)日：2022-01-11

申请号：US16912991

申请日：2020-06-26

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Yu-Chen Chen ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： H01L21/677 ,  H01L23/04 ,  G05D5/04 ,  B23Q15/00 ,  B23Q16/00

摘要： A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.