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公开(公告)号:US12266573B2
公开(公告)日:2025-04-01
申请号:US17483043
申请日:2021-09-23
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yi Chen Ho , Yiting Chang , Chi-Hsun Lin , Zheng-Yang Pan
IPC: H01L21/8234 , H01L21/02 , H01L21/762 , H01L27/088
Abstract: In an embodiment, a device includes: an isolation region on a substrate; a first semiconductor fin protruding above the isolation region; a second semiconductor fin protruding above the isolation region; and a dielectric fin between the first semiconductor fin and the second semiconductor fin, the dielectric fin protruding above the isolation region, the dielectric fin including: a first layer including a first dielectric material having a first carbon concentration; and a second layer on the first layer, the second layer including a second dielectric material having a second carbon concentration, the second carbon concentration greater than the first carbon concentration.
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公开(公告)号:US20240379450A1
公开(公告)日:2024-11-14
申请号:US18780110
申请日:2024-07-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yi Chen Ho , Yiting Chang , Chi-Hsun Lin , Zheng-Yang Pan
IPC: H01L21/8234 , H01L21/02 , H01L21/762 , H01L27/088
Abstract: In an embodiment, a device includes: an isolation region on a substrate; a first semiconductor fin protruding above the isolation region; a second semiconductor fin protruding above the isolation region; and a dielectric fin between the first semiconductor fin and the second semiconductor fin, the dielectric fin protruding above the isolation region, the dielectric fin including: a first layer including a first dielectric material having a first carbon concentration; and a second layer on the first layer, the second layer including a second dielectric material having a second carbon concentration, the second carbon concentration greater than the first carbon concentration.
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公开(公告)号:US20230008893A1
公开(公告)日:2023-01-12
申请号:US17483043
申请日:2021-09-23
Applicant: Taiwan Semiconductor Manufacturing co., Ltd.
Inventor: Yi Chen Ho , Yiting Chang , Chi-Hsun Lin , Zheng-Yang Pan
IPC: H01L21/8234 , H01L27/088 , H01L21/02 , H01L21/762
Abstract: In an embodiment, a device includes: an isolation region on a substrate; a first semiconductor fin protruding above the isolation region; a second semiconductor fin protruding above the isolation region; and a dielectric fin between the first semiconductor fin and the second semiconductor fin, the dielectric fin protruding above the isolation region, the dielectric fin including: a first layer including a first dielectric material having a first carbon concentration; and a second layer on the first layer, the second layer including a second dielectric material having a second carbon concentration, the second carbon concentration greater than the first carbon concentration.
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