CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR
    1.
    发明申请
    CAPACITOR, STRUCTURE AND METHOD OF FORMING CAPACITOR 审中-公开
    电容器,形成电容器的结构和方法

    公开(公告)号:US20140009866A1

    公开(公告)日:2014-01-09

    申请号:US13933706

    申请日:2013-07-02

    Abstract: There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane; a first external conductor layer disposed on a part of the first plane; a second external conductor layer disposed on the second plane; a third external conductor layer disposed on another part of the first plane; a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer; a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; and a third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer.

    Abstract translation: 提供一种电容器,包括具有第一平面的电介质层,与第一平面相对的第二平面,以及与第一平面和第二平面连通的多个通孔; 设置在所述第一平面的一部分上的第一外部导体层; 设置在第二平面上的第二外部导体层; 设置在第一平面的另一部分上的第三外部导体层; 容纳在多个通孔的一部分中并连接到第一外部导体层的第一内部导体; 第二内部导体,其容纳在多个所述通孔的另一部分中并连接到所述第二外部导体层; 以及容纳在多个通孔的另一部分中并连接到第二外部导体层和第三外部导体层的第三内部导体。

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