公开(公告)号：US08509516B2

公开(公告)日：2013-08-13

申请号：US13056046

申请日：2009-07-13

申请人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

发明人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

IPC分类号： G06K9/00

CPC分类号： G01N21/9501 ,  G01N21/95607 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12

摘要： Provided is an examination technique to detect defects with high sensitivity at an outer-most repetitive portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness.A circuit pattern inspection apparatus comprises an image detection unit for acquiring an image of a circuit pattern composed of multiple die having a repetitive pattern, a defect judgment unit which composes, in respect of an acquired detected image, reference images by switching addition objectives depending on regions of repetitive pattern and the other regions and compares a composed reference image with the detected image to detect a defect, and a display unit for displaying the image of the detected defect.

摘要翻译： 提供了一种检测技术，用于在半导体器件的存储器垫的最外侧重复部分以及甚至在不具有重复性的外围电路中检测高灵敏度的缺陷。 电路图案检查装置包括：图像检测单元，用于获取由具有重复图案的多个模具组成的电路图案的图像;缺陷判断单元，其针对所获取的检测图像构成参考图像，其根据 重复图案的区域和其他区域，并且将组合的参考图像与检测到的图像进行比较以检测缺陷;以及显示单元，用于显示检测到的缺陷的图像。

公开(公告)号：US20110129141A1

公开(公告)日：2011-06-02

申请号：US13056046

申请日：2009-07-13

申请人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

发明人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

IPC分类号： G06K9/00

CPC分类号： G01N21/9501 ,  G01N21/95607 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12

摘要： Provided is an examination technique to detect defects with high sensitivity at an outer-most repeative portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness.A circuit pattern inspection apparatus comprises an image detection unit for acquiring an image of a circuit pattern composed of multiple die having a repeative pattern, a defect judgement unit which composes, in respect of an acquired detected image, reference images by switching addition objectives depending on regions of repeative pattern and the other regions and compares a composed reference image with the detected image to detect a defect, and a display unit for displaying the image of the detected defect.

摘要翻译： 提供了一种检测技术，用于在半导体器件的存储器衬底的最外侧的重复部分甚至在不具有重复性的外围电路中检测高灵敏度的缺陷。 电路图案检查装置包括：图像检测单元，用于获取由具有重复图案的多个芯片组成的电路图案的图像;缺陷判断单元，其针对所获取的检测图像构成参考图像，其根据 重复图案的区域和其他区域，并将合成的参考图像与检测到的图像进行比较以检测缺陷;以及显示单元，用于显示检测到的缺陷的图像。

公开(公告)号：US08121395B2

公开(公告)日：2012-02-21

申请号：US12393827

申请日：2009-02-26

申请人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

发明人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

IPC分类号： G06K9/00

CPC分类号： G01N21/95607 ,  G06T7/001 ,  G06T2207/10056 ,  G06T2207/30121 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit-pattern inspection apparatus and related method provide a highly sensitive defect inspection of an area including the most circumferential portion of a memory mat of a semiconductor chip formed on a semiconductor wafer. In certain examples, an image of a circuit pattern of a die formed on the semiconductor wafer is acquired to judge whether or not the circuit pattern contains a defect.

摘要翻译： 电路图案检查装置及相关方法提供对形成在半导体晶片上的半导体芯片的存储垫的最周围部分的区域进行高灵敏度的缺陷检查。 在某些示例中，获取形成在半导体晶片上的芯片的电路图案的图像，以判断电路图案是否包含缺陷。

公开(公告)号：US20090226075A1

公开(公告)日：2009-09-10

申请号：US12393827

申请日：2009-02-26

申请人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

发明人： Takashi Hiroi ,  Takeyuki Yoshida ,  Naoki Hosoya ,  Toshifumi Honda

IPC分类号： G06K9/00

CPC分类号： G01N21/95607 ,  G06T7/001 ,  G06T2207/10056 ,  G06T2207/30121 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein are a circuit-pattern inspection apparatus, and a circuit-pattern inspection method, which are capable of making a highly sensitive defect judgment of an area including the most circumferential portion of a memory mat of a semiconductor chip formed on a semiconductor wafer.In order to achieve the above object, the present invention includes the steps of: on the basis of the repeatability of a circuit pattern of a die formed on a semiconductor wafer, distributing data of an image to a plurality of image memories and storing the data therein; comparing the pieces of data of the image stored in the image memories with a combined reference image to generate a difference image, the combined reference image being combined by adding and averaging in a direction of the repeatability; judging that an area in which a difference value of the difference image is larger than a predetermined threshold value is a defect; and integrating and outputting a plurality of pieces of defect information, the defect information including image data judged to be defective and coordinates indicative of the defect.

摘要翻译： 这里公开了一种电路图案检查装置和电路图案检查方法，其能够对形成在半导体晶片上的半导体芯片的存储器垫的最周围部分的区域进行高灵敏度的缺陷判断。 为了实现上述目的，本发明包括以下步骤：基于在半导体晶片上形成的管芯的电路图案的重复性，将图像的数据分配给多个图像存储器并存储数据 其中 将存储在图像存储器中的图像的数据与组合的参考图像进行比较以生成差分图像，通过在重复性的方向上相加和求平均来组合参考图像; 判断差分图像的差值大于预定阈值的区域是缺陷; 并且整合并输出多条缺陷信息，所述缺陷信息包括判断为缺陷的图像数据和指示缺陷的坐标。

公开(公告)号：US20130119250A1

公开(公告)日：2013-05-16

申请号：US13697025

申请日：2011-04-05

申请人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

发明人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

IPC分类号： H01J37/28 ,  H01J37/22

CPC分类号： H01J37/28 ,  G06T7/001 ,  G06T7/136 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/222 ,  H01L22/12

摘要： A conventional pattern inspection, which compares an image to be inspected with a reference image and subjects the resulting difference value to the defect detection using the threshold of defect determination, has difficulty in highly-sensitive inspection. Because defects occur only in specific circuit pattern sections, false reports occur in the conventional pattern inspections which are not based on the position. Disclosed are a defect inspection method and a device thereof which perform a pattern inspection by acquiring a GP image in advance, designating a place to be inspected and a threshold map to the GP image on the GUI, setting the identification reference of the defects, next acquiring the image to be inspected, applying the identification reference to the image to be inspected, and identifying the defects with the identification reference, thereby enabling the highly-sensitive inspection.

摘要翻译： 将待检查的图像与参考图像进行比较并将得到的差分值与使用缺陷确定的阈值进行缺陷检测相对照的常规图案检查在高灵敏度检查中是困难的。 因为缺陷仅在特定的电路图形部分中发生，所以在常规图案检查中出现虚假报告，而不是基于位置。 公开了一种缺陷检查方法及其装置，其通过事先获取GP图像，指定待检查地点和GUI上的GP图像的阈值图来进行图案检查，设置缺陷的识别参考，下一步 获取要检查的图像，将所述识别参考应用于要检查的图像，以及使用所述识别参考来识别所述缺陷，由此实现高度敏感的检查。

公开(公告)号：US08853628B2

公开(公告)日：2014-10-07

申请号：US13697025

申请日：2011-04-05

申请人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

发明人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

IPC分类号： H01J37/28 ,  G06T7/00 ,  H01J37/22 ,  H01L21/66

CPC分类号： H01J37/28 ,  G06T7/001 ,  G06T7/136 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/222 ,  H01L22/12

摘要： A conventional pattern inspection, which compares an image to be inspected with a reference image and subjects the resulting difference value to the defect detection using the threshold of defect determination, has difficulty in highly-sensitive inspection. Because defects occur only in specific circuit pattern sections, false reports occur in the conventional pattern inspections which are not based on the position. Disclosed are a defect inspection method and a device thereof which perform a pattern inspection by acquiring a GP image in advance, designating a place to be inspected and a threshold map to the GP image on the GUI, setting the identification reference of the defects, next acquiring the image to be inspected, applying the identification reference to the image to be inspected, and identifying the defects with the identification reference, thereby enabling the highly-sensitive inspection.

摘要翻译： 将待检查的图像与参考图像进行比较并将得到的差分值与使用缺陷确定的阈值进行缺陷检测相对照的常规图案检查在高灵敏度检查中是困难的。 因为缺陷仅在特定的电路图形部分中发生，所以在常规图案检查中出现虚假报告，而不是基于位置。 公开了一种缺陷检查方法及其装置，其通过事先获取GP图像，指定待检查地点和GUI上的GP图像的阈值图来进行图案检查，设置缺陷的识别参考，下一步 获取要检查的图像，将所述识别参考应用于要检查的图像，以及使用所述识别参考来识别所述缺陷，由此实现高度敏感的检查。

公开(公告)号：US20110188735A1

公开(公告)日：2011-08-04

申请号：US13057782

申请日：2009-06-05

申请人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

发明人： Naoki Hosoya ,  Toshifumi Honda ,  Takashi Hiroi

IPC分类号： G06K9/00

CPC分类号： G01N21/956 ,  G01N2223/6116 ,  G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

摘要： Provided are a method and a device for defect inspection, wherein, in a state where a few DOIs exist in a large number of nuisances, a classification performance can be improved by a few appropriate defect instructions and a high classification performance is ensured while mitigating the burden of user's defect instructions. The method and device for defect inspection is characterized by repeating extraction of one or more defects from a plurality of defects detected by imaging a sample, instruction of a classification class of the extracted defects, and calculation of a classification criterion and a classification performance from the image information and classification class of the defects, and determining, based on the finally obtained classification criterion, the classification class of the unknown defects. This makes it possible to improve a classification performance by a few appropriate defect instructions and ensure a high classification performance while mitigating the burden of user's defect instructions.

摘要翻译： 提供了一种用于缺陷检查的方法和装置，其中，在少数DOI存在大量滋扰的状态下，可以通过少量适当的缺陷指令来提高分类性能，并且在减轻分类性能的同时确保高分类性能 用户的缺陷指示负担。 用于缺陷检查的方法和装置的特征在于，从通过成像样本检测到的多个缺陷中重复提取一个或多个缺陷，提取的缺陷的分类等级的指令，以及来自所述缺陷的分类标准和分类性能的计算 图像信息和分类类的缺陷，并根据最终获得的分类标准确定未知缺陷的分类等级。 这使得可以通过几个适当的缺陷指令提高分类性能，并确保高分类性能，同时减轻用户缺陷指令的负担。

公开(公告)号：US20070047800A1

公开(公告)日：2007-03-01

申请号：US11488734

申请日：2006-07-19

申请人： Takashi Hiroi ,  Naoki Hosoya ,  Hirohito Okuda ,  Koichi Hayakawa ,  Fumihiko Fukunaga

发明人： Takashi Hiroi ,  Naoki Hosoya ,  Hirohito Okuda ,  Koichi Hayakawa ,  Fumihiko Fukunaga

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01J2237/2817

摘要： The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.

摘要翻译： 本发明涉及一种用于检查形成在半导体器件上的图案中的缺陷的缺陷检查装置，在其GUI上，为了确认检查结果，提供了用于显示任何一个或相互面对的特征量的缺陷 ，以及在检查期间的图像或重新获取的图像，并且在GUI上提供用于设置缺陷的分类等级和重要性的装置，并且基于分类等级和由该设置装置设置的缺陷信息的重要性 ，分类条件或缺陷判断条件自动或手动设定，以便容易地设定检查条件。

公开(公告)号：US20060078189A1

公开(公告)日：2006-04-13

申请号：US11196255

申请日：2005-08-04

申请人： Naoki Hosoya ,  Takashi Hiroi

发明人： Naoki Hosoya ,  Takashi Hiroi

IPC分类号： G06K9/00

CPC分类号： G06K9/6255 ,  G06K9/033 ,  G06T7/0004 ,  G06T2207/30148

摘要： To make it possible to produce inspection conditions for optimizing various inspection conditions by extracting DOIs efficiently and instructing them reliably in a state where a few DOIs are hidden among a large number of nuisances. According to the present invention, a semiconductor wafer is inspected, images of defects detected by the inspection are shown on a screen, and an input interface is provided through which any given defect can be selected from among the defects whose images are shown. The inspection is conducted in such a way that the inspection conditions are adjusted to enhance capabilities for detecting the defect instructed by a user.

摘要翻译： 为了有可能通过高效地提取DOI来产生优化各种检查条件的检验条件，并且可以在许多烦扰中隐藏几个DOI的状态下可靠地指示它们。 根据本发明，检查半导体晶片，在屏幕上示出检查中检测到的缺陷的图像，并且提供输入接口，通过该输入接口可以从显示图像的缺陷中选择任何给定的缺陷。 进行检查，使得检查条件被调整以增强用于检测由用户指示的缺陷的能力。

公开(公告)号：US08111902B2

公开(公告)日：2012-02-07

申请号：US11488734

申请日：2006-07-19

申请人： Takashi Hiroi ,  Naoki Hosoya ,  Hirohito Okuda ,  Koichi Hayakawa ,  Fumihiko Fukunaga

发明人： Takashi Hiroi ,  Naoki Hosoya ,  Hirohito Okuda ,  Koichi Hayakawa ,  Fumihiko Fukunaga

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148 ,  H01J37/222 ,  H01J37/28 ,  H01J2237/2817

摘要： The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.

摘要翻译： 本发明涉及一种用于检查形成在半导体器件上的图案中的缺陷的缺陷检查装置，在其GUI上，为了确认检查结果，提供了用于显示任何一个或相互面对的特征量的缺陷 ，以及在检查期间的图像或重新获取的图像，并且在GUI上提供用于设置缺陷的分类等级和重要性的装置，并且基于分类等级和由该设置装置设置的缺陷信息的重要性 ，分类条件或缺陷判断条件自动或手动设定，以便容易地设定检查条件。