公开(公告)号：US06609564B2

公开(公告)日：2003-08-26

申请号：US10024928

申请日：2001-12-19

申请人： Takashi Imaoka ,  Hiroshi Morita ,  Isamu Sugiyama ,  Tadahiro Ohmi ,  Masaki Hirayama

发明人： Takashi Imaoka ,  Hiroshi Morita ,  Isamu Sugiyama ,  Tadahiro Ohmi ,  Masaki Hirayama

IPC分类号： G05D2300

CPC分类号： C02F1/70 ,  C02F5/00 ,  F28D2021/0019 ,  F28F19/00

摘要： A heat exchange cooling system for cooling an object of heat exchange such as machinery, air, or liquid is provided. The system includes a heat exchanger, a cooling water supply device, cooling water circulation piping, a flow rate adjustment valve, a cooling water supply system, and a controller for controlling the flow rate of cooling water. The system includes separate loops for the circulation piping and the cooling supply system. The separate loops are coupled to one another at an inlet and an outlet of the system.

摘要翻译： 提供了用于冷却诸如机械，空气或液体的热交换对象的热交换冷却系统。 该系统包括热交换器，冷却水供应装置，冷却水循环管道，流量调节阀，冷却水供应系统和用于控制冷却水流量的控制器。 该系统包括用于循环管道和冷却供应系统的单独回路。 单独的环在系统的入口和出口处彼此联接。

公开(公告)号：US06350376B1

公开(公告)日：2002-02-26

申请号：US09527700

申请日：2000-03-16

申请人： Takashi Imaoka ,  Hiroshi Morita ,  Isamu Sugiyama ,  Tadahiro Ohmi ,  Masaki Hirayama

发明人： Takashi Imaoka ,  Hiroshi Morita ,  Isamu Sugiyama ,  Tadahiro Ohmi ,  Masaki Hirayama

IPC分类号： C02F120

CPC分类号： C02F1/70 ,  C02F5/00 ,  F28D2021/0019 ,  F28F19/00

摘要： Heat exchange water for cooling an object of heat exchange such as machinery, air, or liquid, which serves to prevent oxidation and deterioration of metal materials used in pipes for supplying/circulating the heat exchange water or in the liquid ends of the heat exchanger, to suppress growth of algae and microorganisms, and to reduce influence on the environment. The heat exchange water is reductive water having zero or negative standard oxidation-reduction potential as determined on the basis of the hydrogen electrode standard.

公开(公告)号：US5439596A

公开(公告)日：1995-08-08

申请号：US167981

申请日：1994-01-27

申请人： Tadahiro Ohmi ,  Isamu Sugiyama

发明人： Tadahiro Ohmi ,  Isamu Sugiyama

IPC分类号： B01D19/00 ,  B01J19/12 ,  C02F1/30 ,  C02F1/72 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B01D19/0078 ,  B01J19/126 ,  C02F1/302 ,  C02F1/725 ,  B01J2219/1227 ,  C02F2103/04

摘要： A method and apparatus for improving the wettability with pure water of the surface of a substrate, in particular, a silicon wafer from which the oxide film has been removed, whereby pure water is brought into contact with the surface of silicon, so that the impurities on the silicon can be completely cleaned away.One feature resides in that microwaves are applied in a state where water is brought into contact with a catalyst. Furthermore, another feature resides in that a catalyst holding means, in which the catalyst is held so as to come in contact with water introduced to the interior thereof, and a microwave producing means for applying the microwaves to the water introduced into the catalyst holding means are provided in the intermediate portion of a piping for delivering the pure water to a use point.

摘要翻译： PCT No.PCT / JP92 / 00837第 371日期：1993年12月23日 102（e）日期1993年12月23日PCT提交1992年7月2日PCT公布。 第WO93 / 01134号公报 日本1993年1月21日。一种用于改善基材表面的纯水的润湿性的方法和装置，特别是已除去氧化膜的硅晶片，从而使纯水与表面接触 的硅，使得硅上的杂质可以被完全清除。 一个特征在于在与催化剂接触的状态下应用微波。 此外，另一个特征在于：催化剂保持装置，其中保持催化剂以与引入其内部的水接触;以及微波产生装置，用于将微波施加到引入催化剂保持装置的水中 设置在用于将纯水输送到使用点的管道的中间部分中。