Fitting device using robot
    1.
    发明授权
    Fitting device using robot 有权
    使用机器人的装置装置

    公开(公告)号:US08424182B2

    公开(公告)日:2013-04-23

    申请号:US13014758

    申请日:2011-01-27

    IPC分类号: B23Q17/00 B23P19/00

    摘要: A fitting device and a fitting method, by which the fitting process can be carried out without damaging workpieces, even when a sufficient moment cannot be detected by pressing the workpiece in the fitting direction. The device includes a fitting status judging part adapted to judge whether a second workpiece is in motion in a fitting direction relative to a first workpiece; a workpiece orientation searching part adapted to change a current orientation of the second workpiece when it is judged that the second workpiece is not in motion in the fitting direction, and search a proper orientation for the second workpiece based on a detected force or speed of the second workpiece in the fitting direction, during the change of the orientation; and a fitting motion commanding part adapted to command a robot which grips the second workpiece to continue the fitting operation, by using the searched proper orientation.

    摘要翻译: 即使在通过在装配方向上按压工件而不能检测到足够的力矩的情况下,可以进行装配处理而不损坏工件的装配装置和装配方法。 该装置包括适于判断第二工件是否相对于第一工件在装配方向上运动的装配状态判断部件; 工件取向检索部,其在判断为所述第二工件在所述嵌合方向上不移动时,适于改变所述第二工件的当前取向,并且基于检测到的所述第二工件的力或速度来搜索所述第二工件的正确取向 第二工件在装配方向上,在取向的改变期间; 以及装配运动指令部分,其适于使通过使用搜索到的适当取向来命令握住第二工件的机器人继续进行装配操作。

    Fitting apparatus
    2.
    发明授权
    Fitting apparatus 有权
    配件设备

    公开(公告)号:US08369983B2

    公开(公告)日:2013-02-05

    申请号:US12138995

    申请日:2008-06-13

    IPC分类号: G06F7/00

    摘要: A fitting apparatus includes a robot arm having, at the forward end thereof, a gripper for holding a workpiece, a force detector for detecting a force and moment received by the workpiece held by the gripper, and a controller for controlling an operation of the robot arm. The controller includes a motion command generating unit for generating an operation command to fit two workpieces to each other, and an operation command correcting unit for correcting the operation command so as to correct the position of the gripper in a direction perpendicular to the fitting direction and the orientation of the gripper around an axis perpendicular to the fitting direction until the detected force and moment become less than or equal to a threshold value, based on either maximum values of the force and moment detected by the force detector while the two workpieces are in contact with each other or the force and moment detected by the force detector when the two workpieces first come into contact with each other.

    摘要翻译: 一种装配装置,包括:机器人臂,其前端具有用于保持工件的夹持器,用于检测由夹持器保持的工件所接收的力和力矩的力检测器,以及用于控制机器人的操作的控制器 臂。 控制器包括:运动指令生成单元,用于产生用于彼此配合两个工件的操作命令;以及操作指令校正单元,用于校正操作命令,以便在与安装方向垂直的方向上校正夹持器的位置,以及 基于在两个工件处于该位置时由力检测器检测到的力和力矩的最大值,所述夹具围绕垂直于装配方向的轴线的取向直到检测到的力和力矩变得小于或等于阈值 当两个工件首先接触时,彼此接触或由力检测器检测到的力和力矩。

    FITTING DEVICE FOR ADJUSTING STATE OF CLOGGING CAUSED IN FIT
    3.
    发明申请
    FITTING DEVICE FOR ADJUSTING STATE OF CLOGGING CAUSED IN FIT 有权
    调整装置状态的装置

    公开(公告)号:US20100057256A1

    公开(公告)日:2010-03-04

    申请号:US12510662

    申请日:2009-07-28

    IPC分类号: G05B15/00

    摘要: A fitting device for fitting a fitting workpiece, which is held by a robot, to a workpiece to be fitted by force control, comprises: a force detecting portion for detecting a force and moment acting on a control point of the fitting workpiece; a judging portion for judging whether or not clogging is caused between the fitting workpiece and the workpiece to be fitted at the time of fitting; and a changing portion for changing a position of the control point according to a distance by which the fitting workpiece enters the workpiece to be fitted and for pressing the fitting workpiece against the workpiece to be fitted in a direction perpendicular to the fitting direction so as to adjust a posture of the fitting workpiece on the basis of the control point that has been changed, in the case where it is judged by the judging portion that clogging is caused. Due to the foregoing, posture of the fitting workpiece can be appropriately adjusted in a short period of time so that the fitting workpiece can be fitted into the workpiece to be fitted.

    摘要翻译: 一种用于将由机器人保持的装配工件装配到通过力控制装配的工件的装配装置,包括:力检测部分,用于检测作用在装配工件的控制点上的力和力矩; 一个判断部分,用于判断装配工件与装配时要装配的工件之间是否产生堵塞; 以及改变部分,用于根据装配工件进入待装配工件的距离来改变控制点的位置,并且用于将装配工件压靠在垂直于装配方向的方向上的待装配工件上,以便 在由判断部判断为发生堵塞的情况下,基于已经改变的控制点来调整装配工件的姿势。 由于上述原因,可以在短时间内适当地调整装配工件的姿势,使得装配工件能够嵌入待安装的工件中。

    Fitting device for adjusting state of clogging caused in fit
    4.
    发明授权
    Fitting device for adjusting state of clogging caused in fit 有权
    适合调整堵塞状态的装置

    公开(公告)号:US07949431B2

    公开(公告)日:2011-05-24

    申请号:US12510662

    申请日:2009-07-28

    IPC分类号: G05B15/00

    摘要: A fitting device for fitting a fitting workpiece, which is held by a robot, to a workpiece to be fitted by force control, comprises: a force detecting portion for detecting a force and moment acting on a control point of the fitting workpiece; a judging portion for judging whether or not clogging is caused between the fitting workpiece and the workpiece to be fitted at the time of fitting; and a changing portion for changing a position of the control point according to a distance by which the fitting workpiece enters the workpiece to be fitted and for pressing the fitting workpiece against the workpiece to be fitted in a direction perpendicular to the fitting direction so as to adjust a posture of the fitting workpiece on the basis of the control point that has been changed, in the case where it is judged by the judging portion that clogging is caused. Due to the foregoing, posture of the fitting workpiece can be appropriately adjusted in a short period of time so that the fitting workpiece can be fitted into the workpiece to be fitted.

    摘要翻译: 一种用于将由机器人保持的装配工件装配到通过力控制装配的工件的装配装置,包括:力检测部分,用于检测作用在装配工件的控制点上的力和力矩; 一个判断部分,用于判断装配工件与装配时要装配的工件之间是否产生堵塞; 以及改变部分,用于根据装配工件进入待装配工件的距离来改变控制点的位置,并且用于将装配工件压靠在垂直于装配方向的方向上的待装配工件上,以便 在由判断部判断为发生堵塞的情况下,基于已经改变的控制点来调整装配工件的姿势。 由于上述原因,可以在短时间内适当地调整装配工件的姿势,使得装配工件能够嵌入待安装的工件中。

    FITTING DEVICE USING ROBOT
    5.
    发明申请
    FITTING DEVICE USING ROBOT 有权
    使用机器人的装置

    公开(公告)号:US20110225787A1

    公开(公告)日:2011-09-22

    申请号:US13014758

    申请日:2011-01-27

    IPC分类号: B23Q17/00 B23P19/00

    摘要: A fitting device and a fitting method, by which the fitting process can be carried out without damaging workpieces, even when a sufficient moment cannot be detected by pressing the workpiece in the fitting direction. The device includes a fitting status judging part adapted to judge whether a second workpiece is in motion in a fitting direction relative to a first workpiece; a workpiece orientation searching part adapted to change a current orientation of the second workpiece when it is judged that the second workpiece is not in motion in the fitting direction, and search a proper orientation for the second workpiece based on a detected force or speed of the second workpiece in the fitting direction, during the change of the orientation; and a fitting motion commanding part adapted to command a robot which grips the second workpiece to continue the fitting operation, by using the searched proper orientation.

    摘要翻译: 即使在通过在装配方向上按压工件而不能检测到足够的力矩的情况下,可以进行装配处理而不损坏工件的装配装置和装配方法。 该装置包括适于判断第二工件是否相对于第一工件在装配方向上运动的装配状态判断部件; 工件取向检索部,其在判断为所述第二工件在所述嵌合方向上不移动时,适于改变所述第二工件的当前取向,并且基于检测到的所述第二工件的力或速度来搜索所述第二工件的正确取向 第二工件在装配方向上,在取向的改变期间; 以及装配运动指令部分,其适于使通过使用搜索到的适当取向来命令握住第二工件的机器人继续进行装配操作。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    6.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号:US20090215247A1

    公开(公告)日:2009-08-27

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在扫描装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Light illumination during wafer dicing to prevent aluminum corrosion
    7.
    发明授权
    Light illumination during wafer dicing to prevent aluminum corrosion 有权
    晶圆切割时的光照,防止铝腐蚀

    公开(公告)号:US07998793B2

    公开(公告)日:2011-08-16

    申请号:US12434637

    申请日:2009-05-02

    IPC分类号: H01L21/00

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射波长为1.1μm以下的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 晶片通过照明装置(7a)和(7b)。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Manufacturing Method of Semiconductor Device
    8.
    发明申请
    Manufacturing Method of Semiconductor Device 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20080138962A1

    公开(公告)日:2008-06-12

    申请号:US11632993

    申请日:2004-07-22

    IPC分类号: H01L21/304

    摘要: Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover (8) of a dicing device (1). After a wafer is placed on a dicing stage (3), when the wafer is diced by a blade (4a) attached to a spindle (5), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices (7a) and (7b). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle (5) or the like is not present on the wafer.

    摘要翻译: 在切割装置(1)的盖(8)的前表面和后表面上布置照射具有1.1μm或更小的波长的光的照明装置(7a)和(7b)。 在将晶片放置在切割台(3)上之后,当通过安装在主轴(5)上的刀片(4a)切割晶片时,将光照射在上表面(元件形成表面)的整个表面上 通过照明装置(7a)和(7b)的晶片。 此时,晶片上的光的照度设定为70勒克司以上且2000lux以下。 通过这种方式,在切割操作期间,晶片上不存在由主轴(5)等构成遮光区域的区域。

    Containment vessel and nuclear power plant

    公开(公告)号:US09818495B2

    公开(公告)日:2017-11-14

    申请号:US13988966

    申请日:2011-09-14

    申请人: Takashi Sato

    发明人: Takashi Sato

    摘要: A containment vessel has an inner shell covering a reactor pressure vessel and an outer shell forming an outer well which is a gas-tight space covering the horizontal outer periphery of the inner shell. The inner shell has a first cylindrical side wall surrounding the horizontal periphery of the reactor pressure vessel, a containment vessel head which covers the upper part of the reactor pressure vessel, and a first top slab connecting in a gas-tight manner the periphery of the containment vessel head and the upper end of the first cylindrical side wall. The outer shell has a second cylindrical side wall surrounding the outer periphery of the first cylindrical side wall, and also has a second to slab connecting in a gas-tight manner the vicinity of the upper end of the second cylindrical side wall and the first cylindrical side wall.