公开(公告)号：US20050160552A1

公开(公告)日：2005-07-28

申请号：US10855340

申请日：2004-05-28

申请人： Takashi Yoshida ,  Osayasu Kikuchi ,  Motoaki Iwasaki ,  Kurao Habaya ,  Tatsuro Yano ,  Takahiro Shiroma

发明人： Takashi Yoshida ,  Osayasu Kikuchi ,  Motoaki Iwasaki ,  Kurao Habaya ,  Tatsuro Yano ,  Takahiro Shiroma

IPC分类号： G11B5/84 ,  A47L5/14 ,  B08B3/00 ,  B08B5/00 ,  B08B5/02 ,  B08B7/00 ,  B08B7/02 ,  B08B7/04 ,  B24C1/00 ,  G11B23/50 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67051 ,  B08B5/02 ,  B08B7/0021 ,  B08B7/02 ,  B24C1/003

摘要： A cleaning apparatus cleans an object to be cleaned by ejecting a cleaning agent from a nozzle. The cleaning apparatus includes a gas ejecting device for ejecting heated gas to a surface of the object to be cleaned. The gas ejecting device is configured to move to a position above the object to be cleaned when cleaning is performed, and retract from the object to be cleaned when cleaning is not performed. An ejection quantity of the heated gas is controlled when cleaning is performed and when cleaning is not performed.

摘要翻译： 清洁装置通过从喷嘴喷射清洁剂来清洁待清洁的物体。 清洁装置包括用于将加热气体喷射到待清洁物体的表面的气体喷射装置。 气体喷射装置被配置为当执行清洁时移动到待清洁物体上方的位置，并且当不执行清洁时从待清洁物体缩回。 当执行清洁并且不执行清洁时，控制加热气体的喷射量。