公开(公告)号：US4899126A

公开(公告)日：1990-02-06

申请号：US293416

申请日：1989-01-04

Applicant: Takeharu Yamada

Inventor： Takeharu Yamada

IPC: H01C1/14 ,  H01C7/00 ,  H01C13/02 ,  H01C17/24 ,  H01C17/28 ,  H01L27/01 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/28

CPC classification number: H01C17/281 ,  H05K1/167 ,  H05K3/28 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/095 ,  H05K2201/09236 ,  H05K2201/10045 ,  H05K2203/1453 ,  Y10T29/49101

Abstract: A thick film resistor type printed circuit board including an insulating substrate, a plurality of pairs of terminal electrode layers made of silver and formed on the insulating substrate, a plurality of resistor layers formed on the terminal electrode layers so as to connect the pairs of the terminal electrode layers, respectively, a plurality of wiring conductive layers made of copper and connected to predetermined ones of the terminal electrode layers so as to coat the predetermined ones of the terminal electrode layers and a protective layer for covering at least a portion of the insulating substrate, in which portion the terminal electrode layers and the resistor layers are formed.

Abstract translation: 一种厚膜电阻器型印刷电路板，包括绝缘基板，多个由银制成的端子电极层，形成在绝缘基板上，多个电阻层形成在端子电极层上，以便连接成对的 端子电极层，分别由铜制成并与预定的端子电极层连接的多个布线导电层，以覆盖预定的端子电极层和用于覆盖绝缘的至少一部分的保护层 衬底，其中形成端子电极层和电阻器层。