公开(公告)号：USD466119S1

公开(公告)日：2002-11-26

申请号：US29149943

申请日：2001-10-24

申请人： Takeshi Funahashi ,  Takuya Wada ,  Keiichi Shinozaki ,  Yoshiyasu Kubota ,  Yasushi Fujita ,  Hitoshi Ito ,  Yuji Himeno

设计人： Takeshi Funahashi ,  Takuya Wada ,  Keiichi Shinozaki ,  Yoshiyasu Kubota ,  Yasushi Fujita ,  Hitoshi Ito ,  Yuji Himeno

公开(公告)号：USD466872S1

公开(公告)日：2002-12-10

申请号：US29144457

申请日：2001-07-05

申请人： Shigeo Matsumoto ,  Yasushi Fujita ,  Hitoshi Ito ,  Yuji Himeno

设计人： Shigeo Matsumoto ,  Yasushi Fujita ,  Hitoshi Ito ,  Yuji Himeno

公开(公告)号：US07166909B2

公开(公告)日：2007-01-23

申请号：US11031388

申请日：2005-01-08

申请人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

发明人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： B29C45/14418 ,  B29C45/14221 ,  B29C45/14639 ,  B29C2045/0036 ,  B29L2031/3481 ,  H05K1/117 ,  H05K3/284

摘要： In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.

摘要翻译： 在模块化电子装置的成型方法中，设置在基板（23）上的多个端子（24）中的每一个的外边缘部分（24a，...）通过弯曲部分（30°R）进行压力变形处理 当上模具（30）与下模具（31）接触以形成上模具和下模具之间的模制空间时，上模具（30）被成形为弯曲的外端部分（24a） （30），其中基板（23）定位在其中，然后在上模具（30）的弯曲部分（30 R）与所述基板（23）紧密接触的状态下，用可溶性树脂填充所述模制空间 在多个端子（24）中的每一个的弯曲的外端部分（24a），最后，在模制空间中的溶解树脂（36）已经固化之后，上模具和下模具（30; 31）彼此分离， 模块电子装置，设置有基板（23），多个端子（24）各自具有铜 获得外露端部（24a）和覆盖基板（23）的树脂模制部分（21; 22），端子（24）暴露于外部。

公开(公告)号：US20050167813A1

公开(公告)日：2005-08-04

申请号：US11095880

申请日：2005-03-31

申请人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

发明人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

IPC分类号： B29C45/14 ,  H05K1/11 ,  H05K3/28 ,  H01L23/02

CPC分类号： B29C45/14418 ,  B29C45/14221 ,  B29C45/14639 ,  B29C2045/0036 ,  B29L2031/3481 ,  H05K1/117 ,  H05K3/284

摘要： In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.

摘要翻译： 在模块化电子装置的成型方法中，设置在基板（23）上的多个端子（24）中的每一个的外边缘部分（24a，...）通过弯曲部分（30°R）进行压力变形处理 当上模具（30）与下模具（31）接触以形成上模具和下模具之间的模制空间时，上模具（30）被成形为弯曲的外端部分（24a） （30），其中基板（23）定位在其中，然后在上模具（30）的弯曲部分（30 R）与所述基板（23）紧密接触的状态下，用可溶性树脂填充所述模制空间 在多个端子（24）中的每一个的弯曲的外端部分（24a），最后，在模制空间中的溶解树脂（36）已经固化之后，上模具和下模具（30; 31）彼此分离， 模块电子装置，设置有基板（23），多个端子（24）各自具有铜 获得外露端部（24a）和覆盖基板（23）的树脂模制部分（21; 22），端子（24）暴露于外部。

公开(公告)号：US07015573B2

公开(公告)日：2006-03-21

申请号：US11095880

申请日：2005-03-31

申请人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

发明人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

IPC分类号： H01L23/22 ,  H01L23/24

CPC分类号： B29C45/14418 ,  B29C45/14221 ,  B29C45/14639 ,  B29C2045/0036 ,  B29L2031/3481 ,  H05K1/117 ,  H05K3/284

摘要： In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.

摘要翻译： 在模块化电子装置的成型方法中，设置在基板（23）上的多个端子（24）中的每一个的外边缘部分（24a，...）通过弯曲部分（30°R）进行压力变形处理 当上模具（30）与下模具（31）接触以形成上模具和下模具之间的模制空间时，上模具（30）被成形为弯曲的外端部分（24a） （30），其中基板（23）定位在其中，然后在上模具（30）的弯曲部分（30 R）与所述基板（23）紧密接触的状态下，用可溶性树脂填充所述模制空间 在多个端子（24）中的每一个的弯曲的外端部分（24a），最后，在模制空间中的溶解树脂（36）已经固化之后，上模具和下模具（30; 31）彼此分离， 模块电子装置，设置有基板（23），多个端子（24）各自具有铜 获得外露端部（24a）和覆盖基板（23）的树脂模制部分（21; 22），端子（24）暴露于外部。

公开(公告)号：US06940159B2

公开(公告)日：2005-09-06

申请号：US10381993

申请日：2002-08-19

申请人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

发明人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

IPC分类号： B29C45/14 ,  H05K1/11 ,  H05K3/28 ,  H01L23/22 ,  H01L23/24

CPC分类号： B29C45/14418 ,  B29C45/14221 ,  B29C45/14639 ,  B29C2045/0036 ,  B29L2031/3481 ,  H05K1/117 ,  H05K3/284

摘要： In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.

摘要翻译： 在模块化电子装置的成型方法中，设置在基板（23）上的多个端子（24）中的每一个的外边缘部分（24a，...）通过弯曲部分（30°R）进行压力变形处理 当上模具（30）与下模具（31）接触以形成上模具和下模具之间的模制空间时，上模具（30）被成形为弯曲的外端部分（24a） （30），其中基板（23）定位在其中，然后在上模具（30）的弯曲部分（30 R）与所述基板（23）紧密接触的状态下，用可溶性树脂填充所述模制空间 在多个端子（24）中的每一个的弯曲的外端部分（24a），最后在模制空间中的溶解的树脂（36）已经固化之后，上模具和下模具（30; 31）彼此分离，使得 模块电子装置，设置有基板（23），多个端子（24）各自具有铜 获得外露端部（24a）和覆盖基板（23）的树脂模制部分（21; 22），端子（24）暴露于外部。

公开(公告)号：US20050116332A1

公开(公告)日：2005-06-02

申请号：US11031388

申请日：2005-01-08

申请人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

发明人： Shoji Morinaga ,  Mitsuru Adachi ,  Yuji Himeno

IPC分类号： B29C45/14 ,  H05K1/11 ,  H05K3/28 ,  H01L23/02

CPC分类号： B29C45/14418 ,  B29C45/14221 ,  B29C45/14639 ,  B29C2045/0036 ,  B29L2031/3481 ,  H05K1/117 ,  H05K3/284

摘要： In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;22) which covers the base board (23) with the terminals (24) exposed to the outside is obtained.

公开(公告)号：US6150712A

公开(公告)日：2000-11-21

申请号：US226123

申请日：1999-01-07

申请人： Yuji Himeno ,  Kouji Mizota

发明人： Yuji Himeno ,  Kouji Mizota

IPC分类号： C25D7/12 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34

CPC分类号： H01L23/495 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426

摘要： Disclosed are a lead frame for a semiconductor device, and a semiconductor device using the lead frame. Inner leads and outer leads of the lead frame are formed to have such a sectional structure that a film of Pd or a Pd alloy is formed on both surfaces or a rear surface of a lead frame directly or through an undercoat, and an Au-plated film is formed on a part of the film of Pd or a Pd alloy. Pd and Au are not applied to unnecessary areas, thus resulting in higher economical and production efficiency. The lead frame has good quality, is economical and has superior productivity. Wires connecting a semiconductor chip and the inner leads have a good connection property and joint portions of the outer leads to an external device also have a good connection property.

摘要翻译： 公开了半导体器件的引线框架和使用引线框架的半导体器件。 引线框架的内部引线和外部引线形成为具有直接或通过底涂层在引线框架的两个表面或后表面上形成Pd或Pd合金的膜的截面结构，并且镀Au 在Pd或Pd合金的一部分膜上形成膜。 Pd和Au不会施加到不需要的区域，从而获得更高的经济性和生产效率。 引线框架质量好，经济实惠，生产效率高。 连接半导体芯片和内部引线的电线具有良好的连接特性，并且外部引线与外部设备的接合部分也具有良好的连接特性。