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公开(公告)号:US4268614A
公开(公告)日:1981-05-19
申请号:US967388
申请日:1978-12-07
申请人: Tamotsu Ueyama , Yukihiko Wada , Masaji Homma , Hitoshi Aisawa , Takayoshi Komatsu , Tatsuhisa Shibata , Hiroharu Kamiyama
发明人: Tamotsu Ueyama , Yukihiko Wada , Masaji Homma , Hitoshi Aisawa , Takayoshi Komatsu , Tatsuhisa Shibata , Hiroharu Kamiyama
CPC分类号: H05K3/184 , H05K3/42 , H05K3/428 , H05K2203/025 , H05K2203/0565 , H05K2203/0574 , H05K2203/1383
摘要: A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced.Such circuit board is prepared by applying onto a laminate with or without copper clad thereon a specific photopolymerizable resin composition, irradiating the resin composition-applied laminate with ultraviolet rays through a pattern mask, treating the thus irradiated laminate with a solvent to remove the unexposed portions of resin composition and applying an electroless copper plating to the unexposed portions. A durable and reliable printed circuit board having a high pecision and high density circuit pattern can be provided very simply, easily at low cost.
摘要翻译: 一种新颖的电路板,其中,在由固化的光聚合树脂组合物限定的空位部分中至少在电路的焊盘部分和通孔部分处形成包括焊盘部分,通孔部分和导体的电路部分, 空位部分镀有化学镀铜。 当只有焊盘部分和通孔部分镀有无电镀铜时,导体都被树脂组合物覆盖,从而可以消除机械和化学损坏的恐惧。 当所有电路部分都镀有化学镀铜时,所需的铜的量可以大大降低。 通过在具有或不具有铜的层压板上涂布特定的光聚合性树脂组合物,通过图案掩模对紫外线照射树脂组合物施加的层压体,用溶剂处理这样照射的层压体以除去未曝光部分来制备这种电路板 的树脂组合物,并对未曝光部分施加化学镀铜。 可以非常简单,容易地以低成本提供具有高精度和高密度电路图案的耐用且可靠的印刷电路板。