公开(公告)号：US07187075B1

公开(公告)日：2007-03-06

申请号：US10903680

申请日：2004-07-29

申请人： Tan Eng Hwa ,  Lim Peng Soon ,  Santhiran S/O Nadarajah ,  Ong Sze Yan

发明人： Tan Eng Hwa ,  Lim Peng Soon ,  Santhiran S/O Nadarajah ,  Ong Sze Yan

IPC分类号： H01L21/10

CPC分类号： H01L21/324 ,  H01L23/16 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.

摘要翻译： 用于通过保护性模塑料在温度波动期间减小施加在半导体晶片上的机械应力的技术。 将热塑性材料附接到模具的顶表面以减轻应力。 当组件膨胀和收缩时，热塑性材料用作模具和模塑料之间的缓冲垫。 热塑性材料可以成形为使得其不覆盖模具表面上的结合垫。