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    Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet
    1.
    发明授权
    Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet 失效
    覆盖板，三板板使用板材，计算机信号总线和使用该板材的电子电路的覆盖结构

    公开(公告)号：US06703909B2

    公开(公告)日：2004-03-09

    申请号：US09991648

    申请日：2001-11-26

    申请人： Taro Miura ,  Yoshikazu Fujishiro

    发明人： Taro Miura ,  Yoshikazu Fujishiro

    IPC分类号： H01P308

    CPC分类号： H05K9/0039 ,  H01P1/215 ,  H05K1/0233

    摘要： The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.

    摘要翻译： 覆盖片包括至少一个由具有混合在其中的氧化物磁性材料或金属磁性材料的树脂化合物制成的磁性材料层，层叠在磁性材料层的一个表面上的接地导体层和用于通过的多个通孔 或者包括由至少一个由具有氧化物磁性材料的树脂化合物或其中混合的金属磁性材料制成的磁性材料层和至少一个电介质层的电介质层构成的层压体，该电介质层的介电常数低于电介质层。 的磁性材料层和层叠在层压体的一个表面上的接地导体层。

    Multilayer through type capacitor array
    2.
    发明授权
    Multilayer through type capacitor array 失效
    多层通式电容阵列

    公开(公告)号：US5590016A

    公开(公告)日：1996-12-31

    申请号：US356834

    申请日：1994-12-14

    申请人： Yoshikazu Fujishiro ,  Takaya Ishigaki ,  Hiraku Harada

    发明人： Yoshikazu Fujishiro ,  Takaya Ishigaki ,  Hiraku Harada

    IPC分类号： H01G4/35 ,  H01G4/20 ,  H01G4/30 ,  H01G4/38 ,  H03H7/00 ,  H01G4/34

    CPC分类号： H01G4/35

    摘要： The invention decreases crosstalk due to capacitive coupling between through type capacitor elements in a multilayer through type capacitor array. On dielectric sheets between electrodes, which constitute a multi capacitor array, through-holes filled with conductive materials are formed, where a central conductor is not present. By electrically connecting conductive materials filled in the through-holes, electrostatic shielding is provided between the through type capacitor elements. Electrical connection is achieved through conductive layers formed outside or inside the through type capacitor elements.

    摘要翻译： 本发明通过多层通式电容器阵列中的贯通型电容器元件之间的电容耦合来降低串扰。 在构成多电容器阵列的电极之间的介质片上形成填充有导电材料的通孔，其中不存在中心导体。 通过电连接填充在通孔中的导电材料，在直通型电容器元件之间提供静电屏蔽。 通过形成在直通型电容器元件外部或内部的导电层实现电连接。