公开(公告)号：US12000879B2

公开(公告)日：2024-06-04

申请号：US16997726

申请日：2020-08-19

Applicant: Technoprobe S.p.A.

Inventor： Roberto Subranni ,  David Heriban ,  Jean-Christophe Villain ,  Jocelyn Perreau ,  Florent Perrocheau ,  Anne Delettre

IPC: B23P19/00 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R3/00 ,  G01R1/07307

Abstract: An apparatus for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, includes a support adapted to support at least two parallel guides, which are provided with a plurality of respective guides holes, and at least one holding means adapted to hold a contact probe to be housed in the guides holes, of the guides. Suitably, the support is a movable support adapted to be moved according to a preset trajectory between a first position, wherein the contact probe is held by the holding means at a predetermined position outside the guides holes, and a second position wherein the contact probe, which is held at the predetermined position, is housed in a set of guides holes that are substantially concentric to each other.