公开(公告)号：US5046389A

公开(公告)日：1991-09-10

申请号：US446785

申请日：1989-12-06

Applicant: Ted L. Thompson ,  David R. Hembree

Inventor： Ted L. Thompson ,  David R. Hembree

IPC: B21D28/34 ,  H01L21/00

CPC classification number: H01L21/67271 ,  B21D28/34 ,  Y10S83/942 ,  Y10T83/0467 ,  Y10T83/2159 ,  Y10T83/2166 ,  Y10T83/2213 ,  Y10T83/6563 ,  Y10T83/8845 ,  Y10T83/8858

Abstract: An inspection station punch block apparatus for removing a portion of an integrated circuit die lead from a lead frame. The missing lead is used to mark a defective die and is lataer monitored by a scanning means which causes rejection of the die from the lead frame. A method of carrying out this operation is also disclosed.

Abstract translation: 一种用于从引线框架去除集成电路裸片引线的一部分的检查站冲压块装置。 缺失的引线用于标记有缺陷的裸片，并且由扫描装置监视，这导致了引线框架的裸片的排除。 还公开了一种执行该操作的方法。

公开(公告)号：US4944446A

公开(公告)日：1990-07-31

申请号：US430257

申请日：1989-11-02

Applicant: Ted L. Thompson

Inventor： Ted L. Thompson

IPC: B23K3/06

CPC classification number: B23K3/06 ,  Y10T29/49798 ,  Y10T83/0577 ,  Y10T83/162 ,  Y10T83/654

Abstract: A method and apparatus for feeding preform wire into a preform dispenser, cutting a piece of preform, transferring the preform to a location over an integrated circuit ceramic package, and placing the preform in the package prior to placing and attaching a die in the ceramic package.

Abstract translation: 一种用于将预制品线材馈送到预成型件分配器中的方法和装置，切割一块预成型件，将预成型件转移到集成电路陶瓷封装上的位置，以及在将模具放置并附接到陶瓷封装之前将预成型件放置在封装中 。