公开(公告)号：US10060668B2

公开(公告)日：2018-08-28

申请号：US13854678

申请日：2013-04-01

Applicant: Temptronic Corporation

Inventor： Kenneth M. Cole, Sr. ,  Michael F. Conroy ,  Edward Lowerre ,  James Pelrin

IPC: F25D23/00 ,  F25D23/06 ,  B01L1/00 ,  G01M99/00 ,  B01L7/00

CPC classification number: F25D23/061 ,  B01L1/00 ,  B01L7/00 ,  B01L2200/147 ,  B01L2300/1838 ,  G01M99/002 ,  Y10T16/063

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.