Process for producing dimethylformamide
    2.
    发明授权
    Process for producing dimethylformamide 失效
    二甲基甲酰胺生产方法

    公开(公告)号:US4218398A

    公开(公告)日:1980-08-19

    申请号:US972257

    申请日:1978-12-22

    CPC分类号: C07C231/00 C07C233/00

    摘要: Dimethylformamide mg.multidot.produced by reaction of monomethylamine and trimethylamine at a molar ratio of trimethylamine to monomethylamine of 0.1-10, with carbon monoxide in the presence of 1-500 mg. atom of at least one of iodine, bromine, iodides and bromides as a catalyst in term of halogen per one mole of raw material methylamines at a temperature of 100.degree.-350.degree. C. under a pressure of at least 50 kg/cm.sup.2 gage. Dimethylformamide is produced in a very high yield with a high selectivity from monomethylamine and trimethylamine having less demand among three species of methylamines formed from methanol and ammonia.

    摘要翻译: 二甲基甲酰胺通过一甲胺和三甲胺以三甲胺与一甲胺的摩尔比为0.1-10与一氧化碳在1-500mg存在下反应生成。 在100-350℃的温度下,在至少50kg / cm2的压力下,每1摩尔原料甲胺中的碘,溴,碘化物和溴化物中的至少一种作为催化剂的原子。 二甲基甲酰胺以非常高的产率以高的选择性从一甲胺和三甲胺生产,在甲醇和氨形成的三种甲胺中的需求较少。

    Method and device for cutting wire formed on semiconductor substrate
    4.
    发明授权
    Method and device for cutting wire formed on semiconductor substrate 失效
    用于切割半导体衬底上形成的线的方法和装置

    公开(公告)号:US07037732B2

    公开(公告)日:2006-05-02

    申请号:US10708587

    申请日:2004-03-12

    IPC分类号: H01L21/00

    摘要: Method and device for cutting a wire with a small number of processing operations. The method includes forming a cut portion by scanning the semiconductor substrate with a focused ion beam to cut the wire. The method further includes forming a clear region continuously from the cut portion by scanning the semiconductor substrate with the focused ion beam. The clear region is free of stray material of the wire.

    摘要翻译: 用少量加工操作切割钢丝的方法和装置。 该方法包括通过用聚焦离子束扫描半导体衬底来切割线,形成切割部分。 该方法还包括通过用聚焦离子束扫描半导体衬底,从切割部分连续地形成透明区域。 透明区域没有电线的杂散材料。