公开(公告)号：US20130201706A1

公开(公告)日：2013-08-08

申请号：US13837670

申请日：2013-03-15

申请人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE ,  Takashi INOUE

发明人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE ,  Takashi INOUE

IPC分类号： F21V29/00

CPC分类号： B60Q1/0408 ,  B60Q1/0094 ,  F21S41/147 ,  F21S41/192 ,  F21S45/43 ,  F21S45/49 ,  F21V23/02 ,  F21V29/677 ,  F21V29/70 ,  F21Y2115/10

摘要： A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member.

摘要翻译： 电路模块包括：照明控制电路，其控制半导体发光元件的点亮; 第一散热构件，其上安装有照明控制电路; 第二散热构件，其与第一散热构件分离并且具有其上安装有半导体发光元件的表面; 以及连接机构，其具有将第一散热构件和第二散热构件连接在一起的壳体和将发光控制电路的信号发送到半导体发光元件的导电部。 壳体由导热系数低于第一散热构件和第二散热构件的材料形成。

公开(公告)号：US20130201707A1

公开(公告)日：2013-08-08

申请号：US13838123

申请日：2013-03-15

申请人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE

发明人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE

IPC分类号： F21V23/00 ,  B60Q1/00 ,  F21V29/00

摘要： In a circuit module, a supporting member has both an element mounting surface on which a package can be mounted and a circuit mounting surface on which a lighting control circuit that controls lighting of a semiconductor light emitting element can be mounted. The lighting control circuit is mounted on the circuit mounting surface. The circuit mounting surface is formed so as to be orthogonalized or inclined with respect to the element mounting surface. Thereby, the length in the longitudinal direction of the circuit module can be made smaller in comparison with that of a circuit module in which a circuit mounting surface and an element mounting surface are formed on the same plane.

摘要翻译： 在电路模块中，支撑构件具有能够安装封装的元件安装表面和可安装用于控制半导体发光元件的点亮的点亮控制电路的电路安装面。 照明控制电路安装在电路安装面上。 电路安装表面形成为相对于元件安装表面正交或倾斜。 因此，与将电路安装面和元件安装面形成在同一平面上的电路模块相比，可以使电路模块的长度方向的长度更小。

公开(公告)号：US20120314436A1

公开(公告)日：2012-12-13

申请号：US13493330

申请日：2012-06-11

申请人： Takashi INOUE ,  Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Naoki SONE ,  Takanori NAMBA ,  Hidetada TANAKA

发明人： Takashi INOUE ,  Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Naoki SONE ,  Takanori NAMBA ,  Hidetada TANAKA

IPC分类号： B60Q1/04 ,  F28F7/00 ,  F21V21/002 ,  F21V29/00 ,  F21V29/02

CPC分类号： F21V29/763 ,  F21S41/147 ,  F21S41/192 ,  F21S45/43 ,  F21S45/47 ,  F21S45/49 ,  F21V19/0025

摘要： In an automotive headlamp, a light-emitting module is configured such that a light-emitting element and a control circuit unit for controlling the lighting of the light-emitting element are structured integrally with each other. A control circuit unit in a position anterior to the light-emitting element in a lamp unit is located below a shade section so that the control circuit unit can be clear of the path of light used to form a low beam light distribution pattern of the light emitted by the light-emitting element. In this setting, the light-emitting element is so located that a main optical axis Ax2 is perpendicular respect to an optical axis Ax1 of the lamp unit and that a light-emitting portion of the light-emitting element protrudes higher than the control circuit unit in the direction of the main optical axis Ax2.

摘要翻译： 在汽车前照灯中，发光模块被配置为使得用于控制发光元件的点亮的发光元件和控制电路单元彼此一体地构造。 在灯单元中位于发光元件前方的位置处的控制电路单元位于阴影部分的下方，使得控制电路单元可以远离用于形成光的近光配光图案的光的路径 由发光元件发射。 在这种情况下，发光元件的位置使得主光轴Ax2相对于灯单元的光轴Ax1垂直，并且发光元件的发光部分比控制电路单元突出 在主光轴Ax2的方向上。