公开(公告)号：US20230317581A1

公开(公告)日：2023-10-05

申请号：US17710912

申请日：2022-03-31

Applicant: Texas Instruments Incorporated

Inventor： Yiqi Tang ,  Jie Chen ,  Chittranjan Mojan Gupta ,  Rajen Muricon Murugan

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L2924/15311 ,  H01L2224/16227 ,  H01L24/32 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/73204

Abstract: In a described example, an apparatus includes: a multilayer package substrate including a die mount area on a die side surface and comprising power pads and ground pads on an opposing board side surface, the multilayer package substrate including post connect locations on the die side surface for receiving power post connects and for receiving ground post connects for a flip chip mounted semiconductor device, the power post connect locations and the ground post connect locations positioned in the die mount area, the power post connect locations and the ground post connect locations intermixed in the die mount area; and a semiconductor device having post connects extending from bond pads on a device side surface of the semiconductor device mounted to the die side surface of the multilayer package substrate by solder joints between the post connects and the post connect locations.