公开(公告)号：US20230194569A1

公开(公告)日：2023-06-22

申请号：US17733999

申请日：2022-04-30

Applicant: Texas Instruments Incorporated

Inventor： Sebastian Meier ,  Helmut Bumberger ,  Heinrich Wachinger

IPC: G01R1/067 ,  G01R31/28 ,  H01L21/66

CPC classification number: G01R1/06783 ,  G01R31/2889 ,  H01L22/14

Abstract: A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.