公开(公告)号：US20140339678A1

公开(公告)日：2014-11-20

申请号：US14450857

申请日：2014-08-04

Applicant: Texas Instruments Incorporated

Inventor： Rick L. WISE ,  Hiroshi YASUDA

IPC: H01L29/36 ,  H01L29/73

CPC classification number: H01L29/36 ,  H01L21/02063 ,  H01L21/2254 ,  H01L29/66242 ,  H01L29/66272 ,  H01L29/73 ,  H01L29/7325

Abstract: An integrated circuit containing a bipolar transistor including an emitter diffused region with a peak doping density higher than 1·1020 atoms/cm3, and an emitter-base junction less than 40 nanometers deep in a base layer. A process of forming the bipolar transistor, which includes forming an emitter dopant atom layer between a base layer and an emitter layer, followed by a flash or laser anneal step to diffuse dopant atoms from the emitter dopant atom layer into the base layer.

Abstract translation: 一种包含双极晶体管的集成电路，其包括具有高于1×1020原子/ cm3的峰值掺杂密度的发射极扩散区域，以及在基极层中小于40纳米深的发射极 - 基极结。 一种形成双极晶体管的工艺，其包括在基极层和发射极层之间形成发射极掺杂剂原子层，随后进行闪光或激光退火步骤，以将掺杂剂原子从发射极掺杂剂原子层扩散到基底层中。

公开(公告)号：US20130328130A1

公开(公告)日：2013-12-12

申请号：US13967918

申请日：2013-08-15

Applicant: Texas Instruments Incorporated

Inventor： Hiroshi YASUDA ,  Berthold STAUFER

IPC: H01L27/06

CPC classification number: H01L27/0623 ,  H01L21/8249 ,  H01L29/1004 ,  H01L29/66287 ,  H01L29/732 ,  H01L29/7833

Abstract: A process of forming an integrated circuit containing a bipolar transistor and an MOS transistor, by forming a base layer of the bipolar transistor using a non-selective epitaxial process so that the base layer has a single crystalline region on a collector active area and a polycrystalline region on adjacent field oxide, and concurrently implanting the MOS gate layer and the polycrystalline region of the base layer, so that the base-collector junction extends into the substrate less than one-third of the depth of the field oxide, and vertically cumulative doping density of the polycrystalline region of the base layer is between 80 percent and 125 percent of a vertically cumulative doping density of the MOS gate. An integrated circuit containing a bipolar transistor and an MOS transistor formed by the described process.