公开(公告)号：US20130298827A1

公开(公告)日：2013-11-14

申请号：US13946772

申请日：2013-07-19

Applicant: Texas Instruments Incorporated

Inventor： Frank Yu ,  Eric Hsieh ,  Kevin Jin

IPC: B05C11/10

CPC classification number: B05C11/10 ,  B29C47/0009 ,  B29C47/026

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract translation: 包括可移动的分配器组件。 分配器包括其中具有粘结粘合剂的储存器，其中包括颗粒和液体载体。 移动分配器以向分配器提供搅拌以将粘合粘合剂混合成均匀的颗粒混合物和液体载体。 在所述分配器的端部处的开口将粘合粘合剂分配到工件上的粘合位置上，而不从分离器附接装置移除分配器。 一个控制器，用于发送控制信号，该控制信号在将所述体积的粘结粘合剂分配到所述工件的所述表面上之前触发所述可移动分配器组件的移动以混合所述粘合粘合剂 控制器包括基于将参数比较在预定极限或范围内来控制诸如振荡之类的运动以保持粘合粘合剂良好混合的逻辑。

公开(公告)号：US09272302B2

公开(公告)日：2016-03-01

申请号：US13946772

申请日：2013-07-19

Applicant: Texas Instruments Incorporated

Inventor： Frank Yu ,  Eric Hsieh ,  Kevin Jin

IPC: B05C11/10 ,  B29C47/02 ,  B29C47/00

CPC classification number: B05C11/10 ,  B29C47/0009 ,  B29C47/026

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract translation: 包括可移动的分配器组件。 分配器包括其中具有粘结粘合剂的储存器，其中包括颗粒和液体载体。 移动分配器以向分配器提供搅拌以将粘合粘合剂混合成均匀的颗粒混合物和液体载体。 在所述分配器的端部处的开口将粘合粘合剂分配到工件上的粘合位置上，而不从分离器附接装置移除分配器。 一个控制器，用于发送控制信号，该控制信号在将所述体积的粘结粘合剂分配到所述工件的所述表面上之前触发所述可移动分配器组件的移动以混合所述粘合粘合剂 控制器包括基于将参数比较在预定极限或范围内来控制诸如振荡之类的运动以保持粘合粘合剂良好混合的逻辑。