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公开(公告)号：US20240219425A1
公开(公告)日：2024-07-04
申请号：US18603091
申请日：2024-03-12
Applicant: Texas Instruments Incorporated
Inventor： Xinkun Huang , Dok Won Lee , Christopher Michael Ledbetter , Bret Alan Dahl , Roy Deidrick Solomon
CPC classification number: G01R1/07342 , G01R1/0491 , G01R33/072
Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
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公开(公告)号：US20210231729A1
公开(公告)日：2021-07-29
申请号：US17158994
申请日：2021-01-26
Applicant: Texas Instruments Incorporated
Inventor： Ming-Chuan You , Andrew Patrick Couch , Phillip Marcus Blitz , Xinkun Huang , Chi-Tsung Lee , Roy Deidrick Solomon , Enis Tuncer
IPC: G01R31/28
Abstract: An integrated circuit testing assembly that includes: (i) a first slug configured to contact a first surface of a first set of pins of an integrated circuit; (ii) a second slug configured to contact a second surface of the first set of pins of the integrated circuit; (iii) a third slug configured to contact a first surface of a second set of pins of the integrated circuit; and (iv) a fourth slug configured to contact a second surface of the second set of pins of the integrated circuit.
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公开(公告)号：US11927604B2
公开(公告)日：2024-03-12
申请号：US17313657
申请日：2021-05-06
Applicant: Texas Instruments Incorporated
Inventor： Xinkun Huang , Dok Won Lee , Christopher Michael Ledbetter , Bret Alan Dahl , Roy Deidrick Solomon
CPC classification number: G01R1/07342 , G01R1/0491 , G01R33/072
Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
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公开(公告)号：US20210356497A1
公开(公告)日：2021-11-18
申请号：US17313657
申请日：2021-05-06
Applicant: Texas Instruments Incorporated
Inventor： Xinkun Huang , Dok Won Lee , Christopher Michael Ledbetter , Bret Alan Dahl , Roy Deidrick Solomon
Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
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