专利检索 ap:("The Board of Trustees of the Leland Stanford Junior University") AND inv:"Zheng Chen" 第 1 页

1.

发明授权
Fast and reversible thermoresponsive polymer switching materials 有权

公开(公告)号：US11001695B2

公开(公告)日：2021-05-11

申请号：US16065990

申请日：2017-01-09

申请人： The Board of Trustees of the Leland Stanford Junior University

发明人： Zhenan Bao , Yi Cui , Zheng Chen

IPC分类号： C08K3/08 , C08K9/02 , C08L101/12 , H01M4/66 , H01M50/446 , C08K3/04 , C08L23/06 , C08L27/16 , H01M10/44 , H01M10/60 , H01M10/42 , C08K7/18

摘要： A polymer composite includes a polymeric matrix and conductive fillers dispersed in the polymeric matrix. The polymeric matrix includes a polymer having a thermal expansion coefficient of at least about 100 μm/(m K), and the conductive fillers have surface texturing.

2.

发明申请
FAST AND REVERSIBLE THERMORESPONSIVE POLYMER SWITCHING MATERIALS 审中-公开

公开(公告)号：US20190016871A1

公开(公告)日：2019-01-17

申请号：US16065990

申请日：2017-01-09

申请人： The Board of Trustees of the Leland Stanford Junior University

发明人： Zhenan Bao , Yi Cui , Zheng Chen

IPC分类号： C08K3/08 , C08K3/04 , C08K9/02 , C08K7/18 , C08L23/06 , C08L27/16 , H01M4/66 , H01M10/42 , H01M10/44

摘要： A polymer composite includes a polymeric matrix and conductive fillers dispersed in the polymeric matrix. The polymeric matrix includes a polymer having a thermal expansion coefficient of at least about 100 μm/(m K), and the conductive fillers have surface texturing.