公开(公告)号：US11745440B2

公开(公告)日：2023-09-05

申请号：US16840315

申请日：2020-04-03

Applicant: The Boeing Company

Inventor： Da Zhao ,  Keith Daniel Humfeld

IPC: B29C70/38 ,  B29C33/02 ,  B29C33/38

CPC classification number: B29C70/38 ,  B29C33/02 ,  B29C33/38

Abstract: There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.

公开(公告)号：US20210308961A1

公开(公告)日：2021-10-07

申请号：US16840315

申请日：2020-04-03

Applicant: The Boeing Company

Inventor： Da Zhao ,  Keith Daniel Humfeld

IPC: B29C70/38 ,  B29C33/38 ,  B29C33/02

Abstract: There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.