METHODS FOR FORMING CHIP-SCALE ELECTRICAL COMPONENTS
    1.
    发明申请
    METHODS FOR FORMING CHIP-SCALE ELECTRICAL COMPONENTS 有权
    形成芯片电气部件的方法

    公开(公告)号:US20150070123A1

    公开(公告)日:2015-03-12

    申请号:US14482874

    申请日:2014-09-10

    摘要: A method of forming a planar, low loss electrical component such as an inductor or transmission line is provided. A channel can be formed on a top surface of a substrate. A threading plate can be positioned on an upper surface of the channel. A wire or fiber can be introduced through the substrate, the channel, and the threading plate. The wire or fiber can then be guided into the channel using the threading plate. The substrate and the threading plate can then be removed.

    摘要翻译: 提供了形成诸如电感器或传输线的平面,低损耗电气部件的方法。 可以在衬底的顶表面上形成通道。 穿线板可以定位在通道的上表面上。 导线或纤维可以通过基板,通道和螺纹板引入。 然后可以使用螺纹板将线或纤维引导到通道中。 然后可以去除衬底和穿线板。