公开(公告)号：US20230022182A1

公开(公告)日：2023-01-26

申请号：US17710822

申请日：2022-03-31

Applicant: The Intel Corporation

Inventor： Juha Paavola ,  Justin M. Huttula ,  Jerrod Peterson ,  Shawn McEuen ,  Kerry A. Stevens

IPC: G06F1/20 ,  H05K7/20

Abstract: Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.