公开(公告)号：US20020176238A1

公开(公告)日：2002-11-28

申请号：US10194074

申请日：2002-07-15

申请人： The Panda Project, Inc.

发明人： Stanford W. Crane JR. ,  Lakshminarasimha Krishnapura ,  Yun Li ,  Moises Behar ,  Dan Fuoco ,  Bill Ahearn

IPC分类号： H01R009/00

CPC分类号： H01L23/5382 ,  H01L23/49861 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/30107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

摘要翻译： 多芯片模块包括具有绝缘侧壁和端板的壳体，从侧壁延伸的导电引线，安装到端板的集成电路（IC）模具和安装到端板的一个或多个互连模具。 端板由诸如铜的散热材料制成。 每个互连裸片位于一对IC芯片之间。 导电材料将IC芯片连接到互连裸片，将IC芯片连接到导电引线，并将互连裸片连接到导电引线。 互连管芯用于互连IC管芯并将IC管芯与导电引线互连。 互连裸片可以由形成在硅衬底上的布线层来实现。