公开(公告)号：US20230255038A1

公开(公告)日：2023-08-10

申请号：US18012359

申请日：2021-10-08

Applicant: The University of Tokyo ,  PI-CRYSTAL INC. ,  ORGANO-CIRCUIT INC.

Inventor： Junichi Takeya ,  Kazuyoshi Watanabe ,  Han Nozawa ,  Yuichi Ono

IPC: H10K10/46 ,  H10K77/10 ,  H10K71/13 ,  H01L23/14 ,  H01L23/528

CPC classification number: H10K10/46 ,  H10K77/111 ,  H10K71/13 ,  H01L23/14 ,  H01L23/5283

Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device that is capable of improving the connection reliability between an electronic element and a substrate in a semiconductor device in which the electronic element is fixed to the substrate. The semiconductor device includes: a substrate 10 provided with wirings and wiring connection parts 12 connected to the wirings; electronic elements 20, 30, 40, and 50 electrically connected to the wiring connection parts 12 and fixed to the substrate; and a resin film 60 laminated on one surface of the substrate 10, conforming to the shapes of the electronic elements 20, 30, 40, and 50, and covering the electronic elements 20, 30, 40, and 50.