公开(公告)号：US11832420B2

公开(公告)日：2023-11-28

申请号：US17017004

申请日：2020-09-10

申请人： Therlect Co., Ltd

发明人： Chien Yu Chen

IPC分类号： H05K7/20 ,  F28D15/02 ,  F28F23/00

CPC分类号： H05K7/20336 ,  F28D15/0283 ,  F28F23/00 ,  F28F2275/025 ,  F28F2275/065

摘要： A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.

公开(公告)号：US20210289663A1

公开(公告)日：2021-09-16

申请号：US17017004

申请日：2020-09-10

申请人： Therlect Co., Ltd

发明人： Chien Yu Chen

IPC分类号： H05K7/20 ,  F28D15/02

摘要： A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.

公开(公告)号：US11337337B2

公开(公告)日：2022-05-17

申请号：US17017033

申请日：2020-09-10

申请人： Therlect Co., Ltd

发明人： Chien Yu Chen

IPC分类号： H05K7/20

摘要： A dissipating device applied to an electronic device and configured to absorb the heat source generated by the electronic device. A thermal conductive fluid is filled in the dissipating device of the present disclosure. The thermal conductive fluid is a mixture of two immiscible fluid mediums. When the thermal conductive fluid contacts the heat source of the electronic device, the thermal conductive fluid will continuously undergo a phase transition cycle to speed up the heat dissipation effect of the dissipating device on the electronic device and achieve an excellent heat dissipation effect.

公开(公告)号：US20210289664A1

公开(公告)日：2021-09-16

申请号：US17017033

申请日：2020-09-10

申请人： Therlect Co., Ltd

发明人： Chien Yu Chen

IPC分类号： H05K7/20

摘要： A dissipating device applied to an electronic device and configured to absorb the heat source generated by the electronic device. A thermal conductive fluid is filled in the dissipating device of the present disclosure. The thermal conductive fluid is a mixture of two immiscible fluid mediums. When the thermal conductive fluid contacts the heat source of the electronic device, the thermal conductive fluid will continuously undergo a phase transition cycle to speed up the heat dissipation effect of the dissipating device on the electronic device and achieve an excellent heat dissipation effect.