公开(公告)号：US20240255243A1

公开(公告)日：2024-08-01

申请号：US18634965

申请日：2024-04-14

申请人： Kyle Borden MARQUIS

发明人： Kyle Borden MARQUIS

IPC分类号： F28F21/02 ,  B64G1/50 ,  F28F13/00

CPC分类号： F28F21/02 ,  B64G1/503 ,  F28F2013/001 ,  F28F2275/025 ,  F28F2275/08

摘要： A radiator assembly having a plurality of thermally conductive layers arranged in a stack of layers and a heat transfer clamping bracket operably coupled to a first end of the layers of the stack, the clamping bracket being configured to deliver heat from a heat source to the layers. Each stack of layers has a tapered overall shape in cross section due to sequentially shorter lengths of the thermally conductive layers exposing a second end of each layer to a surrounding environment for heat rejection, a total thickness of the stack diminishing with distance away from said heat transfer clamping bracket.

公开(公告)号：US12038241B2

公开(公告)日：2024-07-16

申请号：US17385920

申请日：2021-07-27

申请人： Kyle Borden Marquis

发明人： Kyle Borden Marquis

IPC分类号： F28F21/02 ,  B64G1/50 ,  F28F13/00

CPC分类号： F28F21/02 ,  B64G1/503 ,  F28F2013/001 ,  F28F2275/025 ,  F28F2275/08

摘要： A radiator which rejects heat to its surrounding environment through radiation, comprising layers of thermally conductive material in a tapered geometry. As well, a radiator which incorporates structural support to maintain rigidity in the out-of-plane directions for its thermally conductive layers. The radiator is used by incorporating a source of heat to the layers, having a lower temperature in the surrounding environment, and structurally attaching to an assigned location.

公开(公告)号：US11864355B2

公开(公告)日：2024-01-02

申请号：US17923149

申请日：2021-05-28

申请人： SHOWA MARUTSUTSU COMPANY, LTD.

发明人： Katsuhiko Kagawa ,  Takayuki Yamaguchi

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  F28F2255/02 ,  F28F2275/025

摘要： A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5≤[(S1−S0)/S0]×100≤20 when an area of the thermal conductor in a planar view in a first direction is expressed by S0 [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.

公开(公告)号：US20230416577A1

公开(公告)日：2023-12-28

申请号：US18038404

申请日：2021-10-22

申请人： LG ELECTRONICS INC.

发明人： Dongwook LEE ,  Hongjung KIM ,  Kyungho JUNG ,  Junhan KWON

IPC分类号： C09J101/08 ,  F28F3/06 ,  C09J11/04 ,  C09J11/06

CPC分类号： C09J101/08 ,  F28F3/06 ,  C09J11/04 ,  C09J11/06 ,  F28F2275/025

摘要： Discussed is an adhesive containing a solid content, wherein the solid content can include cellulose, and carboxy methyl cellulose endowed with a carboxy methyl group.

公开(公告)号：US20230328929A1

公开(公告)日：2023-10-12

申请号：US17923149

申请日：2021-05-28

申请人： SHOWA MARUTSUTSU COMPANY, LTD.

发明人： Katsuhiko KAGAWA ,  Takayuki YAMAGUCHI

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  F28F2255/02 ,  F28F2275/025

摘要： A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5 ≤ [(S1 -S0)/ S0] x 100 ≤ 20 when an area of the thermal conductor in a planar view in a first direction is expressed by SO [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.

公开(公告)号：US20230269916A1

公开(公告)日：2023-08-24

申请号：US18151647

申请日：2023-01-09

申请人： Aptiv Technologies Limited

发明人： Jakub Antoni Korta ,  Tomasz Dolot

IPC分类号： H05K7/20 ,  F28F9/02 ,  F28D1/03

CPC分类号： H05K7/20872 ,  F28F9/0256 ,  F28D1/03 ,  F28F2275/025 ,  F28F2275/08 ,  F28F21/065

摘要： This document describes inlet and outlet channels for a heat exchanger that provides a compact profile with consistent cooling performances among heat exchanger plates. For example, a manifold of a cooling system includes an inlet channel and an outlet channel designed to connect to multiple plates of a heat exchanger. The inlet and outlet channels include a junction portion, a connection portion, and a transfer portion. The junction portion includes opposing inclined contact surfaces that are inclined relative to a horizontal plane of the plates and mate with corresponding inclined contact surfaces of the plates. The connection portion accepts coolant hoses. The transfer portion is located between the junction portion and connection portions. The described channels of the manifold are especially useful for automotive applications that generally have tight assembly spaces.

公开(公告)号：US11686539B2

公开(公告)日：2023-06-27

申请号：US16813202

申请日：2020-03-09

申请人： Raytheon Company

发明人： James S. Wilson ,  James Giesey

IPC分类号： F28F9/02 ,  F28F1/02 ,  F28F1/40 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20

CPC分类号： F28F9/026 ,  F28F1/022 ,  F28F1/40 ,  F28F3/025 ,  F28F3/12 ,  H05K7/20254 ,  F28F2275/025 ,  F28F2275/04 ,  F28F2275/06

摘要： A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

公开(公告)号：US20180151473A1

公开(公告)日：2018-05-31

申请号：US15391651

申请日：2016-12-27

申请人： ENZOTECHNOLOGY CORP.

发明人： Kuo-An Liang

IPC分类号： H01L23/473 ,  F28F9/00 ,  F28F21/06 ,  F28F9/26 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L23/473 ,  F28F9/001 ,  F28F9/002 ,  F28F9/266 ,  F28F21/065 ,  F28F2275/025 ,  H01L23/3672 ,  H01L23/4006 ,  H01L2023/4025 ,  H01L2023/4037 ,  H01L2023/4087 ,  H05K7/20254

摘要： The present invention relates to a lightweight liquid-cooling-plate assembly having a plastic frame and a heat dissipation system using the same. The liquid-cooling-plate assembly includes a plastic frame and at least one coolant chamber unit. The plastic frame includes a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements. The lateral walls are connected with each other to form and define the at least one accommodation opening. The fastening elements are disposed on a part of the lateral walls. The coolant chamber unit is connected with the plastic frame and embedded in the at least one accommodation opening, and includes at least one surface exposed.

公开(公告)号：US20170276437A1

公开(公告)日：2017-09-28

申请号：US15317415

申请日：2015-06-12

申请人： GUANGZHOU WIDE INDUSTRIAL CO., LTD.

发明人： Zhiming Li ,  Dong Tan ,  Yong Zhang

IPC分类号： F28F3/02 ,  F28F1/12 ,  F28F1/02 ,  F28F3/08 ,  F28F3/10

CPC分类号： F28F3/025 ,  F28D1/0477 ,  F28D1/0478 ,  F28D5/02 ,  F28D2021/0066 ,  F28D2021/007 ,  F28F1/025 ,  F28F1/126 ,  F28F1/20 ,  F28F3/06 ,  F28F3/086 ,  F28F3/10 ,  F28F19/02 ,  F28F21/082 ,  F28F21/083 ,  F28F21/085 ,  F28F2275/025

摘要： The present invention discloses a combined plate-and-tube heat exchange evaporative condenser, which comprises a fan, a water pump, a water sprayer, a reservoir and a combined plate-and-tube heat exchanger; the combined plate-and-tube heat exchanger is composed of a plurality of combined plate-and-tube heat exchange pieces connected by inlet headers and outlet headers; the combined plate-and-tube heat exchange piece comprises a heat transfer plate and a serpentine tube machined by the heat exchange tube; the heat transfer plate is provided with a groove, and the shape of the groove is matched with that of the serpentine tube; the serpentine tube is disposed in the groove, and a gap between the serpentine tube and the groove is filled with a thermally conductive adhesive layer.

公开(公告)号：US20170176117A1

公开(公告)日：2017-06-22

申请号：US14981970

申请日：2015-12-29

申请人： Industrial Technology Research Institute

发明人： Jin-Bao Wu ,  Wei-Chien Tsai ,  Hao-Wen Cheng ,  Ming-Sheng Leu ,  Jia-Jen Chang ,  Hsien-Lin Hu

IPC分类号： F28F21/02

CPC分类号： F28F21/02 ,  F28D2021/0029 ,  F28F2275/025 ,  H01L23/373 ,  H01L23/3737

摘要： A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.