Abstract:
A compressive sintering system is described that comprises a die set and a vacuum chamber into which the die set is placed. The die set comprises a die casing and opposing rams forming a die cavity loaded with material to be sintered and is configured to compress the material during sintering. At least one of the opposing rams comprises a surface protection layer, such as a faceplate, in contact with the material to be sintered.
Abstract:
A system and method for compressively sintering a material is described. The method comprises the steps of loading a material to be sintered into a die cavity of a die set and placing the die set into a vacuum chamber of a sintering apparatus, which further comprises a temperature measurement device configured to determine the temperature of material in the die cavity during sintering. The apparatus further comprises a control system configured to move the temperature measurement device during sintering in order to maintain its relative positioning to a target location of the die cavity. The present invention further relates to a sintering apparatus capable of performing this method.