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1.发明申请公开(公告)号：US20190135501A1
公开(公告)日：2019-05-09
申请号：US16094169
申请日：2017-04-18
Applicant: Thin Film Electronics ASA
Inventor： Aditi CHANDRA , David ULAND , Alex CHANDLER
IPC: B65D41/62 , G06K19/077
Abstract: A bottle having a sealing device and a substrate attached thereto, and methods of attaching the substrate to the bottle are disclosed. Methods include placing the substrate on the bottle, the bottle having a break line, and the substrate having a wireless communication device having an antenna, an integrated circuit, and a sensing line thereon. Methods further include adhering a first part of the substrate including the antenna to a first portion of the bottle that does not include the break line, and a second part of the substrate including the sensing line to a second portion of the bottle and on/over a break line. The bottle includes an interface between the sealing device and defines a break line. The substrate including the wireless communication device is on/over the bottle, at least a part of the sealing device and the break line.
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公开(公告)号：US20180285706A1
公开(公告)日：2018-10-04
申请号：US15765885
申请日：2015-10-06
Applicant: Thin Film Electronics ASA
Inventor： Mao TAKASHIMA , Jacob BOYD , Aditi CHANDRA
Abstract: An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.
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