公开(公告)号：US20180285706A1

公开(公告)日：2018-10-04

申请号：US15765885

申请日：2015-10-06

Applicant: Thin Film Electronics ASA

Inventor： Mao TAKASHIMA ,  Jacob BOYD ,  Aditi CHANDRA

IPC: G06K19/07 ,  H01Q1/22 ,  H01Q7/00 ,  H05K1/16 ,  H05K3/12 ,  H05K3/36 ,  G08B13/24

Abstract: An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.