公开(公告)号：US10826158B2

公开(公告)日：2020-11-03

申请号：US16287126

申请日：2019-02-27

Applicant: Thin Film Electronics ASA

Inventor： Somnath Mukherjee ,  Aditi Chandra ,  Mao Ito ,  Arvind Kamath ,  Scott Bruner ,  Sambhu Kundu ,  Anand Deshpande

IPC: H01L23/52 ,  H01Q1/22 ,  H01L23/532 ,  H01L23/528 ,  H01L23/64 ,  H01L23/522 ,  H01L23/66

Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.